Inventors:
Robert D. Albin - Santa Rosa CA
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
H03D 902
Abstract:
A finline structure comprises a dielectric substrate-mounted circuit disposed within a waveguide having on the substrate integrated distributed capacitance elements at least partially formed by laterally separated metallization layers. Thin-film construction techniques may be employed in construction. In general, the distributed capacitance elements permit the biasing of a plurality of circuit elements in a finline transmission medium. In selected structures, r. f. continuity is effected between traces and metallization layers while maintaining d. c. isolation. Examples are described of circuits which can incorporate an integrated capacitor, including but not limited to detectors, r. f. modulators, r. f. attenuators, amplifiers, and multipliers.