Inventors:
Chiu-Wing Tsui - Santa Clara CA
Richard H. Crockett - San Jose CA
International Classification:
H01L 2100, H01L 2102, G03F 726
Abstract:
A method for heating or cooling a semiconductor wafer in semiconductor processing apparatus is described which comprises directing into contact with a surface of the wafer at least a portion of one or more components of the process gas to transfer heat between the wafer and a wafer support positioned in the apparatus adjacent to the wafer. Method and apparatus are also described for controlling the total flow of process gas through the apparatus and for monitoring the pressure in said apparatus to maintain the desired pressure therein.