RAYMOND ALLISON PHILLIPS, JR
Pilots at Rdg Rd, Vestal, NY

2003008, May 1, 2003

Nov 26, 2002

10/305643

Terry Dornbos - Vestal NY, US
Raymond Phillips - Vestal NY, US
Mark Pierson - Binghamton NY, US
William Rudik - Vestal NY, US
David Thomas - Endicott NY, US

H01L021/44

438/118000

A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface. The metallic stiffener is placed on the adhesive layer, wherein the adhesive layer mechanically couples the stiffener to the substrate surface and electrically couples the stiffener to the pad. The adhesive layer is then cured such as by pressurization at elevated temperature. Embodiments of the present invention form the adhesive layer by forming an electrically conductive contact on the pad and setting a dry adhesive on the substrate, such that the electrically conductive contact is within a hole in the dry adhesive. The electrically conductive contact electrically couples the stiffener to the pad. The curing step includes curing both the dry adhesive and the electrically conductive contact, resulting in the dry adhesive adhesively coupling the stiffener to the substrate. The electrically conductive contact may include an electrically conductive adhesive or a metallic solder. Additional embodiments of the present invention form the adhesive layer by applying an electrically conductive adhesive on the substrate, wherein after the stiffener is placed on the adhesive layer, the electrically conductive adhesive mechanically and electrically couples the stiffener to the surface of the substrate.

6040631, Mar 21, 2000

Jan 27, 1999

9/238872

Eric P. Dibble - Endicott NY
Eric A. Johnson - Greene NY
Raymond A. Phillips - Vestal NY

International Business Machines Corporation - Armonk NY

H01L 2348, H01L 2352, H01L 2940

257783

An improved bonding system is provided in which a metal heat spreader is bonded to semiconductor chip. A two adhesive system is used in which a first adhesive demonstrates high bond strength with a second adhesive exhibits high thermal conductivity.

6212077, Apr 3, 2001

Jan 25, 1999

9/237090

Marshall L. Brown - Brackney PA
James A. Busby - Vestal NY
Raymond A. Phillips - Vestal NY
John A. Potenza - Endwell NY
Jirina D. Shupp - Friendsville PA
J. Robert Young - Vestal NY

International Business Machines Corporation - Armonk NY

H01L 2166, H01L 23544

361777

An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.

2001001, Aug 30, 2001

Jan 10, 2001

09/757523

Marshall Brown - Brackney PA, US
James Busby - Vestal NY, US
Raymond Phillips - Vestal NY, US
John Potenza - Endwell NY, US
Jirina Shupp - Friendsville PA, US
J. Young - Vestal NY, US

H05K001/00

361/748000, 174/268000

An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.