Inventors:
Peter Mitchell - Bloomington MN
Assignee:
Cypress Semiconductor Corporation - San Jose CA
International Classification:
H01L 21465
Abstract:
The present invention concerns a method for making an identification mark on a silicon surface. In a preferred embodiment, the identification mark formed on the silicon surface does not substantially score the silicon. A silicon or silicon dioxide surface coated with an insulating layer is marked by laser scribing, leaving an exposed area on the silicon or the silicon dioxide. The exposed area on the silicon wafer is preferably not marked by the laser scribing. The exposed silicon surface is then oxidized by dry or wet oxidizing. The silicon oxide can be subsequently removed to leave an etched mark. The method reduces or eliminates the formation of stresses and silicon slag at the etched mark that can cause defects and reduce yield.