Inventors:
Gerald English - Glen Ellyn IL, US
Allan Zuehlsdorf - Sycamore IL, US
Peter Doyle - Los Altos CA, US
Aleksey Pirkhalo - Chicago IL, US
Assignee:
Laird Technologies, Inc. - Chesterfield MO
International Classification:
H05K 9/00
Abstract:
In one exemplary embodiment, an EMI shield assembly generally includes a frame adapted to be secured to a mounting surface, a cover attachable to the frame, and at least one resilient electrically-conductive member disposed on an inner side of the cover. The at least one resilient electrically-conductive member may be configured to contact at least one electrically-conductive surface on the mounting surface, to establish a current-conducting path from the electrically-conductive surface to the cover when the cover is attached to the frame. The at least one resilient electrically-conductive member may be configured to be compressed against at least one electrically-conductive surface on the mounting surface when the cover is attached to the frame. This compression may help provide an effective amount of contact pressure against the at least one electrically-conductive surface to establish a predetermined or desirable level of electrical conductivity.