Inventors:
John Esbenshade - Clayton DE, US
Andrew M. Geiger - Newark DE, US
Paul Libbers - Claymont DE, US
Samuel J. November - Newtown PA, US
Paul J. Sacchetti - Warrington PA, US
Jonathan Tracy - Kennett Square PA, US
David Verbaro - Cinnaminson NJ, US
Michael E. Watkins - Bear DE, US
Assignee:
Rohm and Haas Electroinic Materials CMP Holidays, Inc. - Newark DE
International Classification:
B24D 3/00, B01F 13/02
Abstract:
A method for manufacturing chemical mechanical polishing pad polishing layers that minimizes entrained gas inclusion defects is provided. Also provided is a mix head assembly for use in the manufacture of chemical mechanical polishing pad polishing layers, wherein inclusions of entrained gas inclusion defects are minimized.