MATTHEW RANDALL SMITH
Pilots at Sentimental Ln, Apex, NC

License number
North Carolina A5257753
Issued Date
Jul 2015
Expiration Date
Jul 2016
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
4209 Sentimental Ln, Apex, NC 27539

Professional information

Matthew Smith Photo 1

Curable Protectant For Electronic Assemblies

US Patent:
2013024, Sep 19, 2013
Filed:
Apr 26, 2013
Appl. No.:
13/871601
Inventors:
MELISSA KERN - Mt. Airy NC, US
MATTHEW W. SMITH - Apex NC, US
Assignee:
LORD Corporation - Cary NC
International Classification:
H01L 21/56
US Classification:
438127
Abstract:
Latent thermal initiators and protectant compositions that remain shelf stable at elevated temperatures, yet readily cure during a solder bump reflow process or other high temperature processing. The thermal initiators comprise thermally labile cation-anion pairs where the blocked cation prevents cure at low temperatures, and the unblocked cation initiates cure at high temperatures. Also provided is a method of making a preferred initiator comprising the cation [N-(4-methylbenzyl)-N,N-dimethylanalinium] and the anion [N(SOCF)].


Matthew Smith Photo 2

Curable Protectant For Electronic Assemblies

US Patent:
2012014, Jun 14, 2012
Filed:
Feb 22, 2012
Appl. No.:
13/401924
Inventors:
Russell A. Stapleton - Apex NC, US
Melissa R. Kern - Mt. Airy NC, US
Matthew W. Smith - Apex NC, US
International Classification:
B32B 37/12
US Classification:
156330
Abstract:
Latent thermal initiators and protectant compositions that remain shelf stable at elevated temperatures, yet readily cure during a solder bump reflow process or other high temperature processing. The thermal initiators comprise thermally labile cation-anion pairs where the blocked cation prevents cure at low temperatures, and the unblocked cation initiates cure at high temperatures. Also provided is a method of making a preferred initiator comprising the cation [N-(4-methylbenzyl)-N,N-dimethylanalinium] and the anion [N(SOCF)].


Matthew Smith Photo 3

Curable Protectant For Electronic Assemblies

US Patent:
2008001, Jan 17, 2008
Filed:
May 16, 2007
Appl. No.:
11/749457
Inventors:
Russell Stapleton - Apex NC, US
Melissa Kern - Mt. Airy NC, US
Matthew Smith - Apex NC, US
International Classification:
H01L 23/34, C07C 211/43, C07D 241/00, H01L 21/56
US Classification:
257713000, 438114000, 438119000, 438127000, 544336000, 564305000, 257E23080, 257E21502
Abstract:
Latent thermal initiators and protectant compositions that remain shelf stable at elevated temperatures, yet readily cure during a solder bump reflow process or other high temperature processing. The thermal initiators comprise thermally labile cation-anion pairs where the blocked cation prevents cure at low temperatures, and the unblocked cation initiates cure at high temperatures. Also provided is a method of making a preferred initiator comprising the cation N-(4-methylbenzyl)-N,N-dimethylanalinium] and the anion [N(SOCF)].