MARK A JOHNSON, DO
Marriage and Family Therapists at 1 St, Meridian, ID
License number
Idaho OL20000133
Category
Osteopathic Medicine
Type
Family Medicine
License number
Idaho O-0583
Category
Osteopathic Medicine
Type
Family Medicine
Address
Address
1648 NW 1St St, Meridian, ID 83642
Phone
(208) 888-9393
(208) 888-9525 (Fax)
(208) 888-9525 (Fax)
Organization information
See more information about MARK A JOHNSON at bizstanding.comMark Johnson MD,DO
1130 E Fairview Ave, Meridian, ID 83642
Industry:
Family Doctor
Phone:
(208) 888-9393 (Phone)
Mark Alexander Johnson
Professional information
Dr. Mark A Johnson, Meridian ID - DO (Doctor of Osteopathic Medicine)
Specialties:
Family Medicine
Address:
Primary Health Medical Group
1130 E Fairview Ave, Meridian 83642
(208) 888-9393 (Phone)
3915 Talbot Rd S STE 401, Renton 98055
1130 E Fairview Ave, Meridian 83642
(208) 888-9393 (Phone)
3915 Talbot Rd S STE 401, Renton 98055
Languages:
English
Hospitals:
Primary Health Medical Group
1130 E Fairview Ave, Meridian 83642
3915 Talbot Rd S STE 401, Renton 98055
Valley Medical Center
400 South 43Rd St, Renton 98055
1130 E Fairview Ave, Meridian 83642
3915 Talbot Rd S STE 401, Renton 98055
Valley Medical Center
400 South 43Rd St, Renton 98055
Education:
Medical School
Western Univ Of Health Sciences/College Of Osteopathic Medicine Of The Pacific, Western University Of Health Sciences
Graduated: 2007
Western Univ Of Health Sciences/College Of Osteopathic Medicine Of The Pacific, Western University Of Health Sciences
Graduated: 2007
Mark A Johnson, Meridian ID
Specialties:
Family Physician
Address:
1130 E Fairview Ave, Meridian, ID 83642
Microelectronic Component Assemblies And Microelectronic Component Lead Frame Structures
US Patent:
7923824, Apr 12, 2011
Filed:
Nov 20, 2007
Appl. No.:
11/943103
Inventors:
Mark S. Johnson - Meridian ID, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 23/495
US Classification:
257670, 257666, 257E23043, 438123
Abstract:
The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of leads extending in a first direction and a dam bar. Each of the leads may have an outer length and an outer edge. The dam bar may include a plurality of dam bar elements, with each dam bar element being joined to the outer lengths of two adjacent leads. In this example, each dam bar element has an outer edge that extends farther outwardly than the outer edges of the two adjacent leads. The outer edges of the leads and the outer edges of the dam bar elements together define an irregular outer edge of the dam bar. Other lead frame structures and various microelectronic component assemblies are also shown and described.
Stacked Microfeature Devices And Associated Methods
US Patent:
2013021, Aug 22, 2013
Filed:
Mar 18, 2013
Appl. No.:
13/845953
Inventors:
Micron Technology, Inc. - , US
Kok Chua Tan - Singapore, SG
Vince Chan Seng Leong - Singapore, SG
Mark S. Johnson - Meridian ID, US
Kok Chua Tan - Singapore, SG
Vince Chan Seng Leong - Singapore, SG
Mark S. Johnson - Meridian ID, US
Assignee:
MICRON TECHNOLOGY, INC. - Boise ID
International Classification:
H01L 23/00
US Classification:
438109
Abstract:
Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.
Conductive Structures For Microfeature Devices And Methods For Fabricating Microfeature Devices
US Patent:
2012030, Nov 29, 2012
Filed:
Jun 29, 2012
Appl. No.:
13/538891
Inventors:
Mark S. Johnson - Meridian ID, US
Assignee:
MICRON TECHNOLOGY, INC. - Boise ID
International Classification:
H01L 21/768
US Classification:
438598, 257E21575
Abstract:
Methods for fabricating conductive structures on and/or in interposing devices and microfeature devices that are formed using such methods are disclosed herein. In one embodiment, a method for fabricating interposer devices having substrates includes forming a plurality of conductive sections on a first substrate in a first pattern. The method continues by forming a plurality of conductive sections on a second substrate in a second pattern. The method further includes constructing a plurality of conductive lines in a common third pattern on both the first substrate and the second substrate. The conductive lines can be formed on the first and second substrates either before or after forming the first pattern of conductive sections on the first substrate and/or forming the second pattern of conductive sections on the second substrate.
Microelectronic Component Assemblies And Microelectronic Component Lead Frame Structures
US Patent:
7652365, Jan 26, 2010
Filed:
Nov 20, 2007
Appl. No.:
11/942996
Inventors:
Mark S. Johnson - Meridian ID, US
Assignee:
Micron Technologies, Inc. - Boise ID
International Classification:
H01L 23/495
US Classification:
257692, 257666, 257E23047, 438123
Abstract:
The present invention provides microelectronic component assemblies and lead frame structures that may be useful in such assemblies. For example, one such lead frame structure may include a set of leads extending in a first direction and a dam bar. Each of the leads may have an outer length and an outer edge. The dam bar may include a plurality of dam bar elements, with each dam bar element being joined to the outer lengths of two adjacent leads. In this example, each dam bar element has an outer edge that extends farther outwardly than the outer edges of the two adjacent leads. The outer edges of the leads and the outer edges of the dam bar elements together define an irregular outer edge of the dam bar. Other lead frame structures and various microelectronic component assemblies are also shown and described.
Conductive Structures For Microfeature Devices And Methods For Fabricating Microfeature Devices
US Patent:
8222727, Jul 17, 2012
Filed:
Nov 5, 2009
Appl. No.:
12/613413
Inventors:
Mark S. Johnson - Meridian ID, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 23/04
US Classification:
257698, 257E21575, 257E21597, 438598, 438667
Abstract:
Methods for fabricating conductive structures on and/or in interposing devices and microfeature devices that are formed using such methods are disclosed herein. In one embodiment, a method for fabricating interposer devices having substrates includes forming a plurality of conductive sections on a first substrate in a first pattern. The method continues by forming a plurality of conductive sections on a second substrate in a second pattern. The method further includes constructing a plurality of conductive lines in a common third pattern on both the first substrate and the second substrate. The conductive lines can be formed on the first and second substrates either before or after forming the first pattern of conductive sections on the first substrate and/or forming the second pattern of conductive sections on the second substrate.
Stacked Microfeature Devices
US Patent:
8400780, Mar 19, 2013
Filed:
Jun 22, 2010
Appl. No.:
12/820704
Inventors:
Mung Suan Heng - Singapore, SG
Kok Chua Tan - Singapore, SG
Vince Chan Seng Leong - Singapore, SG
Mark S. Johnson - Meridian ID, US
Kok Chua Tan - Singapore, SG
Vince Chan Seng Leong - Singapore, SG
Mark S. Johnson - Meridian ID, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H05K 1/11, H05K 1/14
US Classification:
361784, 361764, 361772, 361790
Abstract:
Stacked microfeature devices and associated methods of manufacture are disclosed. A package in accordance with one embodiment includes first and second microfeature devices having corresponding first and second bond pad surfaces that face toward each other. First bond pads can be positioned at least proximate to the first bond pad surface and second bond pads can be positioned at least proximate to the second bond pad surface. A package connection site can provide electrical communication between the first microfeature device and components external to the package. A wirebond can be coupled between at least one of the first bond pads and the package connection site, and an electrically conductive link can be coupled between the first microfeature device and at least one of the second bond pads of the second microfeature device. Accordingly, the first microfeature device can form a portion of an electrical link to the second microfeature device.
Method For Stacking Die In Thin, Small-Outline Package
US Patent:
2011014, Jun 23, 2011
Filed:
Dec 21, 2009
Appl. No.:
12/643796
Inventors:
Tracy V. Reynolds - Boise ID, US
Mark S. Johnson - Meridian ID, US
Mark S. Johnson - Meridian ID, US
Assignee:
MICRON TECHNOLOGY, INC. - Boise ID
International Classification:
H01L 25/065, H01L 21/98
US Classification:
257686, 438109, 257690, 257E21705, 257E21499, 257E23141, 257E25013
Abstract:
Several embodiments of microelectronic device packaging configurations with lead frames without downsets are disclosed herein. In one embodiment, the configuration includes a pair of microelectronic dies with active surfaces facing one another, and a lead frame positioned between the dies. The lead frame has no downset and extends from between the dies and protrudes out of an encapsulant material. In one embodiment the lead frame is connected to both an upper and a lower die. In other embodiments, the lead frame is connected to a first die by wirebonds and is not connected to a second die. The first and second die may be connected to one another by interconnects such as solder ball interconnects.
Redistribution Structures For Microfeature Workpieces
US Patent:
2009005, Mar 5, 2009
Filed:
Aug 28, 2007
Appl. No.:
11/846460
Inventors:
Mark S. Johnson - Meridian ID, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 23/552, H01L 21/4763
US Classification:
257659, 438637, 257E21495, 257E23114
Abstract:
Microfeature dies with redistribution structures that reduce or eliminate line interference are disclosed. The microfeature dies can include a substrate having a bond site and integrated circuitry electrically connected to the bond site. The microfeature dies can also include and a redistribution structure coupled to the substrate. The redistribution structure can include an external contact site configured to receive an electric coupler, a conductive line that is electrically connected to the external contact site and the bond site, and a conductive shield that at least partially surrounds the conductive line.