JOHN F. DAVIS, MD
Marriage and Family Therapists at Vest Mill Cir, Winston Salem, NC

6295724, Oct 2, 2001

Oct 28, 1999

9/428750

Alan Harris Crudo - Endicott NY
John Gillette Davis - Charlotte NC
Christian Robert Le Coz - Endicott NY
Mark Vincent Pierson - Binghamton NY
Amit Kumar Sarkhel - Endicott NY
Ajit Kumar Trivedi - Endicott NY

International Business Machines Corporation - Armonk NY

B23P 1900

29762

A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process.

6018866, Feb 1, 2000

Feb 13, 1998

9/023552

Alan Harris Crudo - Endicott NY
John Gillette Davis - Charlotte NC
Christian Robert Le Coz - Endicott NY
Mark Vincent Pierson - Binghamton NY
Amit Kumar Sarkhel - Endicott NY
Ajit Kumar Trivedi - Endicott NY

International Business Machines Corporation - Armonk NY

B23P 1900

29740

A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process.

6043110, Mar 28, 2000

Jan 5, 1999

9/225268

John G. Davis - Charlotte NC
Michael A. Gaynes - Vestal NY
Joseph D. Poole - Troutman NC

International Business Machines Corporation - Armonk NY

H01L 2144, H01L 2148, H01L 2150

438118

Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Volume and thickness of the bond are controlled by the inclusion of a wire mesh embedded in a preform or through which the thermoplastic adhesive is pressed during bonding. The wire mesh also increases heat transfer through the adhesive in a regulated and even manner over the area of the bond or any desired portion thereof. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.

6115912, Sep 12, 2000

Oct 28, 1999

9/428751

Alan Harris Crudo - Endicott NY
John Gillette Davis - Charlotte NC
Christian Robert Le Coz - Endicott NY
Mark Vincent Pierson - Binghamton NY
Amit Kumar Sarkhel - Endicott NY
Ajit Kumar Trivedi - Endicott NY

International Business Machines Corporation - Armonk NY

H05K 334

29840

A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process.