Jay Karl Meyer
Veterinary at Westview Rd, Fort Collins, CO
License number
Colorado 6659
Issued Date
Oct 17, 1997
Renew Date
Oct 31, 1998
Expiration Date
Oct 31, 1998
Type
Veterinarian
Address
Address
2106 Westview Rd, Fort Collins, CO 80524
Professional information
Engineer At Avago Technologies
Position:
Engineer at Avago Technologies
Location:
Fort Collins, Colorado Area
Industry:
Semiconductors
Work:
Avago Technologies
-
Engineer
Education:
University of Minnesota-Twin Cities 1994 - 1996
MS, Electrical and Electronics Engineering
MS, Electrical and Electronics Engineering
Method For Fabricating Low Leakage Interconnect Layers In Integrated Circuits
US Patent:
2007002, Jan 25, 2007
Filed:
Sep 22, 2006
Appl. No.:
11/525428
Inventors:
Chintamani Palsule - Fort Collins CO, US
Jay Meyer - Fort Collins CO, US
John Stanback - Fort Collins CO, US
Jeremy Theil - Mountain View CA, US
Mark Crook - Fort Collins CO, US
Kirk Lindahl - Louisville CO, US
Jay Meyer - Fort Collins CO, US
John Stanback - Fort Collins CO, US
Jeremy Theil - Mountain View CA, US
Mark Crook - Fort Collins CO, US
Kirk Lindahl - Louisville CO, US
International Classification:
H01L 21/4763
US Classification:
438636000
Abstract:
A method for fabricating a low leakage integrated circuit structure. An antireflective layer is disposed without intervening layers directly onto the top of an interconnect conductor, and a dielectric layer is disposed over the antireflective layer. The interconnect conductor is aluminum; the antireflective layer is titanium nitride, and the antireflective layer has thickness less than or equal to 650 angstroms and greater than or equal to 150 angstroms. A contact window is opened with the contact window extending at least down to the antireflective layer.
Method For Fabricating Low Leakage Interconnect Layers In Integrated Circuits
US Patent:
2006009, May 11, 2006
Filed:
Nov 9, 2004
Appl. No.:
10/984701
Inventors:
Chintamani Palsule - Fort Collins CO, US
Jay Meyer - Fort Collins CO, US
John Stanback - Fort Collins CO, US
Jeremy Theil - Mountain View CA, US
Mark Crook - Fort Collins CO, US
Kirk Lindahl - Louisville CO, US
Jay Meyer - Fort Collins CO, US
John Stanback - Fort Collins CO, US
Jeremy Theil - Mountain View CA, US
Mark Crook - Fort Collins CO, US
Kirk Lindahl - Louisville CO, US
International Classification:
H01L 21/4763
US Classification:
438636000
Abstract:
A method for fabricating a low leakage integrated circuit structure. An antireflective layer is disposed without intervening layers directly onto the top of an interconnect conductor, and a dielectric layer is disposed over the antireflective layer. The interconnect conductor is aluminum; the antireflective layer is titanium nitride, and the antireflective layer has thickness less than or equal to 650 angstroms and greater than or equal to 150 angstroms. A contact window is opened with the contact window extending at least down to the antireflective layer.