JASON GONZALEZ, PA-C
Nursing at Genesee Ave, La Jolla, CA
License number
California 1066137
Category
Nursing
Type
Physician Assistant
License number
California PA52207
Category
Nursing
Type
Surgical
Address
Address
2
9850 Genesee Ave SUITE 560, La Jolla, CA 92037
10170 Sorrento Valley Rd, San Diego, CA 92121
10170 Sorrento Valley Rd, San Diego, CA 92121
Phone
(858) 455-6330
(858) 784-5888
(858) 784-5888
Professional information
Senior Staff Engineer/Manager At Qualcomm
Position:
Senior Staff Engineer at Qualcomm
Location:
Greater San Diego Area
Industry:
Semiconductors
Work:
Qualcomm
since Feb 2005
-
Senior Staff Engineer
Agilent Technologies
Nov 1999 - Feb 2005
-
High Speed IO Team Manager
Hewlett-Packard
Apr 1995 - Nov 1999
-
Analog Circuit Designer
Education:
Brigham Young University 1989 - 1996
M.S., Electrical & Computer Engineering Los Gatos H.S. 1986 - 1989
M.S., Electrical & Computer Engineering Los Gatos H.S. 1986 - 1989
Languages:
Spanish
Capacitor Die Design For Small Form Factors
US Patent:
2010012, May 20, 2010
Filed:
Nov 18, 2009
Appl. No.:
12/620884
Inventors:
Yuancheng Christopher Pan - San Diego CA, US
Fifin Sweeney - San Diego CA, US
Charlie Paynter - La Jolla CA, US
Kevin R. Bowles - Mission Viejo CA, US
Jason R. Gonzalez - San Diego CA, US
Fifin Sweeney - San Diego CA, US
Charlie Paynter - La Jolla CA, US
Kevin R. Bowles - Mission Viejo CA, US
Jason R. Gonzalez - San Diego CA, US
Assignee:
QUALCOMM INCORPORATED - San Diego CA
International Classification:
H01L 23/52, H01L 21/50, H01L 23/498
US Classification:
257532, 257724, 438121, 438396, 257E21499, 257E23141, 257E2307
Abstract:
A semiconductor package has a capacitor die and a packaging substrate. The capacitor die is coupled to circuitry on a front or back side of a die coupled to the packaging substrate for providing decoupling capacitance. In one example, the capacitor die is coupled to a land side of the packaging substrate in an area depopulated of a packaging array and adjacent to the packaging array. In another example, the capacitor die may be stacked on the die and coupled through wire bonds to circuitry on the die. The capacitor die reduces impedance of the integrated circuit allowing operation at higher frequencies.
Printed Circuit Board Having Embedded Dies And Method Of Forming Same
US Patent:
2013027, Oct 17, 2013
Filed:
Jun 17, 2013
Appl. No.:
13/919230
Inventors:
Jason R. Gonzalez - San Diego CA, US
International Classification:
H01L 25/00
US Classification:
257777
Abstract:
A package includes a printed circuit board (PCB) having a first side and a second side and a thickness between the first side and the second side and a stacked die including a top die mounted on a bottom die, the bottom die being at least partially embedded in the PCB. Also a method of forming a package that includes forming an opening in a top surface of the PCB layer, placing a stacked die including a top die stacked on a bottom die into the opening, laminating the PCB layer to form a laminate layer, and forming an electrical connection with the stacked die.
Printed Circuit Board Having Embedded Dies And Method Of Forming Same
US Patent:
8476750, Jul 2, 2013
Filed:
Dec 10, 2009
Appl. No.:
12/634965
Inventors:
Fifin Sweeney - San Diego CA, US
Jason R. Gonzalez - San Diego CA, US
Jason R. Gonzalez - San Diego CA, US
Assignee:
QUALCOMM Incorporated - San Diego CA
International Classification:
H01L 25/065, H01L 21/98, H01L 23/52
US Classification:
257686
Abstract:
A package includes a printed circuit board (PCB) having a first side and a second side and a thickness between the first side and the second side and a stacked die including a top die mounted on a bottom die, the bottom die being at least partially embedded in the PCB. Also a method of forming a package that includes forming an opening in a top surface of the PCB layer, placing a stacked die including a top die stacked on a bottom die into the opening, laminating the PCB layer to form a laminate layer, and forming an electrical connection with the stacked die.
Wheelbarrow With Retractable Configuration
US Patent:
7334803, Feb 26, 2008
Filed:
Jun 19, 2006
Appl. No.:
11/455057
Inventors:
Jason Gonzalez - San Diego CA, US
International Classification:
B62B 1/24
US Classification:
280 4731, 280 4723, 280 78, 280653, 280 4726, 280 473, 280 4717, 280 4732
Abstract:
An improved wheelbarrow featuring a retractable configuration that permits ready emptying of a wheelbarrow receptacle, with reduced need to tilt, lift or invert the wheelbarrow. A wheelbarrow is disclosed with a retractable configuration that is optionally operable by the user to create an egress for wheelbarrow cargo.