Inventors:
Kevin BENNION - Littleton CO, US
Jason LUSTBADER - Boulder CO, US
Assignee:
ALLIANCE FOR SUSTAINABLE ENERGY, LLC - Golden CO
International Classification:
H01L 23/34, F28D 15/00, F28F 7/00
US Classification:
257712, 165170, 16510413, 257E2308
Abstract:
Embodiments discussed herein are directed to a power semiconductor packaging that removes heat from a semiconductor package through one or more cooling zones that are located in a laterally oriented position with respect to the semiconductor package. Additional embodiments are directed to circuit elements that are constructed from one or more modular power semiconductor packages.