BRETT WILLIAM BAKER, M.D.
Urology at 38 St, Austin, TX
License number
Texas M3880
Category
Radiology
Type
Urology
Address
Address
1301 W 38Th St #200, Austin, TX 78705
Phone
(512) 477-5905
(512) 477-8640 (Fax)
(512) 687-1950
(512) 687-1490 (Fax)
(512) 477-8640 (Fax)
(512) 687-1950
(512) 687-1490 (Fax)
Personal information
See more information about BRETT WILLIAM BAKER at radaris.comName
Address
Phone
4002 Chile Dr, Pasadena, TX 77504
4001 Nasa Pkwy APT 129, El Lago, TX 77586
508 1St St, College Sta, TX 77840
3231 Allen Pkwy, Houston, TX 77019
3311 E Martin Luther King Jr Blvd, Austin, TX 78721
Professional information
Brett William Baker, Austin TX
Specialties:
Urologist
Address:
1301 W 38Th St, Austin, TX 78705
3100 Red River St, Austin, TX 78705
1020 W 34Th St, Austin, TX 78705
3100 Red River St, Austin, TX 78705
1020 W 34Th St, Austin, TX 78705
Board certifications:
American Board of Urology Certification in Urology
Method For Forming A Copper Layer Over A Semiconductor Wafer
US Patent:
6297155, Oct 2, 2001
Filed:
May 3, 1999
Appl. No.:
9/305093
Inventors:
Cindy Reidsema Simpson - Austin TX
Robert Douglas Mikkola - Austin TX
Matthew T. Herrick - Austin TX
Brett Caroline Baker - Austin TX
David Moralez Pena - Buda TX
Edward Acosta - San Marcos TX
Rina Chowdhury - Austin TX
Marijean Azrak - Austin TX
Cindy Kay Goldberg - Austin TX
Mohammed Rabiul Islam - Austin TX
Robert Douglas Mikkola - Austin TX
Matthew T. Herrick - Austin TX
Brett Caroline Baker - Austin TX
David Moralez Pena - Buda TX
Edward Acosta - San Marcos TX
Rina Chowdhury - Austin TX
Marijean Azrak - Austin TX
Cindy Kay Goldberg - Austin TX
Mohammed Rabiul Islam - Austin TX
Assignee:
Motorola Inc. - Schaumburg IL
International Classification:
H01L 2144
US Classification:
438687
Abstract:
A method for electroplating a copper layer (118) over a wafer (20) powers a cathode of an electroplating system (10) in a manner that obtains improved copper interconnects. A control system (34) powers the cathode of the system (10) with a mix of two or more of: (i) positive low-powered DC cycles (201 or 254); (ii) positive high-powered DC cycles (256 or 310); (iii) low-powered, pulsed, positive-power cycles (306 or 530); (iv) high-powered, pulsed, positive-powered cycles (212, 252, 302, or 352); and/or (v) negative pulsed cycles (214, 304, 510, 528, or 532). The collection of these cycles functions to electroplate copper or a like metal (118) onto the wafer (20). During electroplating, insitu process control and/or endpointing (506, 512, or 520) is performed to further improve the resulting copper interconnect.