YUNG CHI CHEN, ACUPUNCTURIST
Acupuncture at Oakland Rd, San Jose, CA
License number
California 17132
Category
Acupuncture
Type
Acupuncturist
Address
Address
1630 Oakland Rd STE A117, San Jose, CA 95131
Phone
(408) 436-8055
Personal information
See more information about YUNG CHI CHEN at radaris.comName
Address
Phone
433 Oliver St, Milpitas, CA 95035
429 Deep Hill Rd, Diamond Bar, CA 91765
448 Dewey Blvd, San Francisco, CA 94116
4225 Maxson Rd, El Monte, CA 91732
4211 Rickeys Way UNIT H, Palo Alto, CA 94306
Professional information
See more information about YUNG CHI CHEN at trustoria.com
Single-Core Two-Side Substrate With U-Strip And Co-Planar Signal Traces, And Power And Ground Planes Through Split-Wrap-Around (Swa) Or Split-Via-Connections (Svc) For Packaging Ic Devices
Single-Core Two-Side Substrate With U-Strip And Co-Planar Signal Traces, And Power And Ground Planes Through Split-Wrap-Around (Swa) Or Split-Via-Connections (Svc) For Packaging Ic Devices
US Patent:
5825084, Oct 20, 1998
Filed:
Feb 11, 1997
Appl. No.:
8/795478
Inventors:
John H. Lau - Palo Alto CA
Yung Shih Chen - San Jose CA
Tai-Yu Chou - Pleasanto CA
Frank H. Wu - Sunnyvale CA
Kuan Luen Chen - San Jose CA
Wei H. Koh - Irvine CA
Yung Shih Chen - San Jose CA
Tai-Yu Chou - Pleasanto CA
Frank H. Wu - Sunnyvale CA
Kuan Luen Chen - San Jose CA
Wei H. Koh - Irvine CA
Assignee:
Express Packaging Systems, Inc. - Palo Alto CA
International Classification:
H01L 2312, H01L 2350, H01L 2328
US Classification:
257700
Abstract:
The present invention discloses a new substrate with two metal layer circuit structure and layout for semiconductor packaging. The speed and performance characteristics of the semiconductor device are optimized while the packaging structure is simplified by utilizing only one dielectric layer and conventional printed circuit board fabrication process. The difficulties encountered due to the complexities and higher cost of production required for the multiple layer and high density configuration are thus avoided. The improved circuit structure is achieved by implementing a segmented ring on one side of a substrate and a split plane on the other side thus forming a single layer substrate structure. The edges of the substrate are coated with metal layer to provide inter-layer connections. In addition to the benefits of high performance, low cost, the improved circuit structure and package layout provide flexibility allowing higher degree of freedom for selecting the location and number of input and output signal lines and connections to the ground and power planes from the semiconductor device.
Stent Coating Apparatus
Stent Coating Apparatus
US Patent:
8616152, Dec 31, 2013
Filed:
Aug 6, 2012
Appl. No.:
13/567920
Inventors:
Yung Ming Chen - San Jose CA, US
Assignee:
Abbott Cardiovascular Systems Inc. - Santa Clara CA
International Classification:
B05C 19/06, B05C 19/04, B05C 19/00, B05C 5/02, B05C 5/00, B05C 11/08, B05C 11/02, B05C 11/10, B05C 11/00
US Classification:
118699, 118696, 118320, 118315, 118313, 118300
Abstract:
An apparatus for coating a stent comprises a coating solution reservoir, a stent support for carrying a stent adjacent the reservoir, transducers for generating waves through the coating solution, and a controller that controls timing at which the transducers are powered in order to eject a droplet of the coating solution.