YU CHEN
Broker in Cambridge, MA

License number
Massachusetts 9537504
Issued Date
Jul 21, 2015
Expiration Date
Jul 21, 2018
Type
Salesperson
Address
Address
Cambridge, MA 02138

Professional information

Yu Chen Photo 1

Process For Fabricating Thin Film Transistors

US Patent:
6825068, Nov 30, 2004
Filed:
Apr 17, 2001
Appl. No.:
09/836884
Inventors:
Kevin L. Denis - Beverly Farms MA
Yu Chen - Cambridge MA
Paul S. Drzaic - Lexington MA
Joseph M. Jacobson - Newton Centre MA
Peter T. Kazlas - Sudbury MA
Assignee:
E Ink Corporation - Cambridge MA
International Classification:
H01L 2100
US Classification:
438149, 438155
Abstract:
Transistors are formed by depositing at least one layer of semiconductor material on a substrate comprising a polyphenylene polyimide. The substrate permits the use of processing temperatures in excess of 300° C. during the processes used to form the transistors, thus allowing the formation of high quality silicon semiconductor layers. The substrate also has a low coefficient of thermal expansion, which closely matches that of silicon, thus reducing any tendency for a silicon layer to crack or delaminate.


Yu Chen Photo 2

Process For Fabricating Thin Film Transistors

US Patent:
7365394, Apr 29, 2008
Filed:
Aug 17, 2004
Appl. No.:
10/919657
Inventors:
Kevin L Denis - Beverly Farms MA, US
Yu Chen - Cambridge MA, US
Paul S Drzaic - Morgan Hill CA, US
Joseph M Jacobson - Newton Centre MA, US
Peter T Kazlas - Sudbury MA, US
Assignee:
E Ink Corporation - Cambridge MA
International Classification:
H01L 27/01
US Classification:
257347, 257E29117
Abstract:
Transistors are formed by depositing at least one layer of semiconductor material on a substrate comprising a polyphenylene polyimide. The substrate permits the use of processing temperatures in excess of 300° C. during the processes used to form the transistors, thus allowing the formation of high quality silicon semiconductor layers. The substrate also has a low coefficient of thermal expansion, which closely matches that of silicon, thus reducing any tendency for a silicon layer to crack or delaminate.


Yu Chen Photo 3

Minimally-Patterned Semiconductor Devices For Display Applications

US Patent:
7030412, Apr 18, 2006
Filed:
May 5, 2000
Appl. No.:
09/565413
Inventors:
Paul S. Drzaic - Lexington MA, US
Karl R. Amundson - Cambridge MA, US
Gregg M. Duthaler - Brookline MA, US
Peter T. Kazlas - Sudbury MA, US
Yu Chen - Cambridge MA, US
Assignee:
E Ink Corporation - Cambridge MA
International Classification:
H01L 29/04
US Classification:
257 59, 257 72
Abstract:
A thin-film transistor array comprises at least first and second transistors. Each transistor comprises a source electrode, a drain electrode a semiconductor electrode, a gate electrode, and a semiconductor layer. The semiconductor layer is continuous between the first and second transistors. The semiconductor layer is preferably unpatterned. In various display applications, the geometry of the transistors is selected to provide acceptable leakage currents. In a preferred embodiment, the transistor array is employed in an encapsulated electrophoretic display.


Yu Chen Photo 4

Minimally- Patterned, Thin-Film Semiconductor Devices For Display Applications

US Patent:
2002006, May 23, 2002
Filed:
Jul 12, 2001
Appl. No.:
09/904435
Inventors:
Peter Kazlas - Sudbury MA, US
Yu Chen - Cambridge MA, US
Kevin Denis - Beverly Farms MA, US
Paul Drzaic - Morgan Hill CA, US
International Classification:
H01L031/112, H01L031/036, H01L029/76
US Classification:
257/066000
Abstract:
A thin-film transistor array comprises at least first and second transistors. Each of the first and second transistors include a shared silicon layer, i.e., an active layer, having a thickness less than approximately 40 nm. The shared silicon layer extends continuously between the first and second transistors. The silicon layer may consist of unpatterned silicon. Heavily doped material may not be required at metal-silicon contact interfaces.