DR. YOUNG KIM
Acupuncture at Sherman Way, Van Nuys, CA
License number
California AC8184
Category
Acupuncture
Type
Acupuncturist
Address
Address
2
14435 Sherman Way, Van Nuys, CA 91405
3099 Anchorage Ave, Simi Valley, CA 93063
3099 Anchorage Ave, Simi Valley, CA 93063
Phone
(818) 780-7715
Organization information
See more information about YOUNG KIM at bizstanding.comYoung Kim DDS
7301 Sepulveda Blvd, Van Nuys, CA 91405
Industry:
Dentists
Phone:
(818) 997-0315 (Phone)
Young One Kim
Professional information
Dr. Young One Kim, Van Nuys CA - DDS (Doctor of Dental Surgery)
Specialties:
Dentistry
Address:
7301 Sepulveda Blvd SUITE 4, Van Nuys 91405
(818) 997-0315 (Phone), (818) 997-0316 (Fax)
(818) 997-0315 (Phone), (818) 997-0316 (Fax)
Languages:
English
Young Han Kim, Van Nuys CA
Specialties:
Acupuncturist
Address:
7112 Van Nuys Blvd, Van Nuys, CA 91405
Young One Kim, Van Nuys CA
Specialties:
Dentist
Address:
7301 Sepulveda Blvd, Van Nuys, CA 91405
Young Kim, Van Nuys CA
Specialties:
Acupuncture
Address:
14435 Sherman Way, Van Nuys 91405
(818) 780-7715 (Phone)
(818) 780-7715 (Phone)
Languages:
English
Young Kim, Van Nuys CA
Specialties:
Psychotherapist
Address:
14435 Sherman Way, Van Nuys, CA 91405
Multi-Layer, Multi-Material Fabrication Methods For Producing Micro-Scale And Millimeter-Scale Devices With Enhanced Electrical And/Or Mechanical Properties
US Patent:
8613846, Dec 24, 2013
Filed:
Oct 18, 2010
Appl. No.:
12/906970
Inventors:
Ming Ting Wu - Northridge CA, US
Young Kim - Sherman Oaks CA, US
Kieun Kim - Pasadena CA, US
Adam L. Cohen - Valley Village CA, US
Ananda H. Kumar - Fremont CA, US
Michael S. Lockard - Lake Elizabeth CA, US
Dennis R. Smalley - Newhall CA, US
Young Kim - Sherman Oaks CA, US
Kieun Kim - Pasadena CA, US
Adam L. Cohen - Valley Village CA, US
Ananda H. Kumar - Fremont CA, US
Michael S. Lockard - Lake Elizabeth CA, US
Dennis R. Smalley - Newhall CA, US
Assignee:
Microfabrica Inc. - Van Nuys CA
International Classification:
C25D 5/02, C25D 5/10
US Classification:
205118, 205170
Abstract:
Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e. g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e. g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e. g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions. Each of these groups of embodiments incorporate both the core material and the coating material during the formation of each layer and each layer is also formed with a sacrificial material that is removed after formation of all layers of the structure.