WILLIAM RICHARD LYLE
Engineers in Gardenville, PA
License number
Pennsylvania PE053022
Category
Engineers
Type
Professional Engineer
Address
Address
Gardenville, PA 18901
Professional information
Purchasing Director At Delaware Valley College
Position:
Purchasing Director at Delaware Valley College
Location:
Greater Philadelphia Area
Industry:
Higher Education
Work:
Delaware Valley College
- Doylestown, PA since Apr 2005
-
Purchasing Director
County of Bucks
2000 - 2005
-
Purchasing Director
Visteon
1993 - 2000
-
Manufacturing Engineer
Education:
Lehigh University 1998 - 2000
MS, Manufacturing Systems Engineering Rensselaer Polytechnic Institute 1991 - 1993
BS, mechanical engineering
MS, Manufacturing Systems Engineering Rensselaer Polytechnic Institute 1991 - 1993
BS, mechanical engineering
Skills:
Procurement, Purchasing, Strategic Sourcing, Spend Analysis, Contract Management, Supply Management, Supply Chain Management, E-procurement, Continuous Improvement, Cross-functional Team Leadership, Management, Project Management, Analysis, Engineering, Lean Manufacturing, Budgets, Leadership, Microsoft Excel, Team Leadership, Microsoft Office, Negotiation, Committee Liaison, Supplier Negotiation
Certifications:
Certified Purchasing Manager (CPM), Institute for Supply Management
Licensed Professional Engineer, Commonwealth of Pennsylvania
Licensed Professional Engineer, Commonwealth of Pennsylvania
Temperature Sensor Assembly
US Patent:
6091317, Jul 18, 2000
Filed:
Jul 6, 1998
Appl. No.:
9/110350
Inventors:
William Richard Lyle - Doylestown PA
Reginald M. Groom - Redford MI
Reginald M. Groom - Redford MI
Assignee:
Ford Motor Company - Dearborn MI
International Classification:
H01C 304
US Classification:
338 28
Abstract:
A temperature sensor assembly (10) including a pair of rigid lead frames (12, 14) having retention pockets (24, 26) thereon for retaining a sensor assembly (32). The sensor assembly (32) includes a surface mount device package (34) containing a thermistor (36). The lead frames (12, 14) are molded into a housing (15) after assembly of the sensor assembly (32) to the lead frames (12, 14).