WILLIAM MACROPOULOS
Broker in Norfolk, MA
License number
Massachusetts 97231
Issued Date
May 1, 1977
Expiration Date
Jul 10, 1993
Type
Broker
Address
Address
Norfolk, MA 02056
Professional information
Three Dimensional Packaging Optimized For High Frequency Circuitry
US Patent:
2006024, Nov 2, 2006
Filed:
Feb 24, 2006
Appl. No.:
11/361513
Inventors:
William Macropoulos - Norfolk MA, US
Izzac Khayo - Nashua NH, US
Greg Mendolia - Nashua NH, US
Izzac Khayo - Nashua NH, US
Greg Mendolia - Nashua NH, US
International Classification:
H04B 1/20
US Classification:
369001000
Abstract:
At least an embodiment of the present technology provides a device, comprising at least one passive component, at least one active component and at least two substrates. The substrates may be advantageously stacked to form a 3D structure. The active and passive components may be advantageously placed in between said substrates to create a compact monolithic 3D device. At least one embodiment of the technology comprises at least a passive component disposed in between said substrates in order to manipulate, distort or otherwise transform at least one electrical signal from one substrate to the next. In another embodiment of the technology at least an interconnector device may be disposed upon at least one substrate in order to respond to mechanical distortions of said substrates under thermal and mechanical stresses. Said interconnector device may be strategically but disjunctively positioned along with other passive components in order to create a rugged compact more efficient 3D package for high frequency operation.
Optimized Circuits For Three Dimensional Packaging And Methods Of Manufacture Therefore
US Patent:
2006021, Sep 28, 2006
Filed:
Feb 14, 2006
Appl. No.:
11/353930
Inventors:
William Macropoulos - Norfolk MA, US
Greg Mendolia - Nashua NH, US
James Oakes - Sudbury MA, US
Izz Khayo - Nashua NH, US
Greg Mendolia - Nashua NH, US
James Oakes - Sudbury MA, US
Izz Khayo - Nashua NH, US
International Classification:
H01L 29/04
US Classification:
257059000
Abstract:
An apparatus, comprising an integrated circuit, wherein a first portion of the integrated circuit is placed on a first substrate and a second portion of the integrated circuit is placed on a second substrate stacked adjacent the first substrate and wherein the first portion and the second portion of the integrated circuit are interconnected.
Apparatus And Method Using Stackable Substrates
US Patent:
2006026, Nov 30, 2006
Filed:
Feb 6, 2006
Appl. No.:
11/349500
Inventors:
William Macropoulos - Norfolk MA, US
Greg Mendolia - Nashua NH, US
Izzac Khayo - Nashua NH, US
Greg Mendolia - Nashua NH, US
Izzac Khayo - Nashua NH, US
International Classification:
H01L 23/02
US Classification:
257686000
Abstract:
An embodiment of the present invention provides an apparatus, comprising a plurality of stacked substrates, wherein the substrates are capable of accepting surface mounted components (SMCs) and wherein the plurality of stacked substrates are separated and connected by the surface mounted components (SMC) or solder balls or both.
Three Dimensional Packaging Optimized For High Frequency Circuitry
US Patent:
2009007, Mar 26, 2009
Filed:
Sep 27, 2008
Appl. No.:
12/286012
Inventors:
William Macropoulos - Norfolk MA, US
Izzac Khayo - Nashua NH, US
Greg Mendolia - Nashua NH, US
Izzac Khayo - Nashua NH, US
Greg Mendolia - Nashua NH, US
International Classification:
H01L 21/50, H01R 12/04
US Classification:
174261, 438113, 257E21499
Abstract:
At least an embodiment of the present technology provides a method of manufacturing a mechanically adapting interconnecting device for multi-substrate packages comprising placing a metal laminate on each side of a polymer composite, forming a channel in the metal laminate; and metallizing the laminate to create a metal connection inside the channel.