WILLIAM JOHN KAUTTER
Pilots at Sandalfoot Way, Columbia, MD

4939453, Jul 3, 1990

Feb 22, 1988

7/158781

William J. Kautter - Columbia MD
Mark D. Wecht - Reisterstown MD
Louis A. Abbagnaro - Silver Spring MD

Pace Incorporated - Laurel MD

G01R 106

324158P

A probe for use with circuitry for monitoring signals emanating from a heated electrical appliance, the probe including a planar member having three layers, the first layer including at least a first electrically conductive portion adapted to support a piece of solder, the second layer being an electrically insulating layer disposed between the first layer and a third layer, the third layer being electrically conductive. A novel method and circuit using the above probe are also disclosed wherein a heated soldering iron or solder extractor tip or the like melts the piece of solder to establish good electrical connection for the signals from the tip to the monitor circuit through the molten solder and the first portion of the first layer.

4972990, Nov 27, 1990

Feb 22, 1988

7/158724

Louis A. Abbagnaro - Silver Spring MD
Robert G. Brown - Annapolis MD
William J. Siegel - Silver Spring MD
William J. Kautter - Columbia MD
Robert S. Quasney - Pasendena MD

Pace Incorporated - Laurel MD

B23K 100

228 20

Apparatus for soldering and desoldering an electronic component to or from a printed circuit board includes an alignment station and a soldering/desoldering station. The printed circuit board is mounted upon an adjusable X-Y table which can be indexed between the alignment station and the soldering/desoldering station. To align an electronic component with respect to th PCB, a vacuum pickup device is operated at the alignment station to pickup and support the component within an optical field of view above the PCB and the X-Y table is adjusted in X, Y and. theta. directions with respect to the component. Upon alignment of the component, the pickup device is lowered to temporarily adhere the component to the PCB by an adhesive flux. Thereafter, the X-Y table is indexed to a preset position below a hot air soldering nozzle and the component soldered in a known manner. A rotary device for shearing a defective electronic device from a PCB is also attached to the bottom of the soldering/desoldering nozzle.

4899920, Feb 13, 1990

Apr 20, 1989

7/340772

Louis A. Abbagnaro - Silver Spring MD
Robert G. Brown - Annapolis MD
William J. Siegel - Silver Spring MD
William J. Kautter - Columbia MD
Robert S. Quasney - Pasendena MD

Pace Incorporated - Laural MD

B23K 300

228 11

This invention relates to a method and apparatus for removing and installing surface mounted devices (SMD's) with respect to a substrate such as a printed circuit board (PCB).

5736686, Apr 7, 1998

Mar 1, 1995

8/396617

Joseph F. Perret - Silver Spring MD
Donald A. Ice - Ellicott City MD
William J. Kautter - Columbia MD

GTCO Corporation - Columbia MD

G08C 2100, G09G 302

178 18

An illumination apparatus for a digitizer tablet includes a support structure and a solid sheet optical light guide supported by the support structure and having first and second opposing surfaces and a plurality of edges. Light sources are carried by the support structure and positioned to direct light into light-receiving edges of the light guide. Reflecting structure is disposed adjacent the first surface of the light guide. A predetermined pattern is disposed on the first surface of the light guide structured and arranged in accordance with distance from the light sources.