WILLIAM J WHITE
Broker in Kates Corner, MA

4807000, Feb 21, 1989

Mar 2, 1987

7/020618

Mark N. Gurnee - Framingham MA
William J. White - Chelmsford MA

Honeywell Inc. - Minneapolis MN

H01L 2714

357 30

A high density optical detector mosaic array assembly having a plurality of interconnect locations comprised of IC readout pads in a pattern suitable for interconnecting a plurality of integrated circuit devices. The assembly comprises a substrate, a plurality of thin film metallization layers alternating with a plurality of thick film dielectric layers wherein the first of the thin film layers is deposited directly on the substrate and is delineated to form a plurality of interconnect lines disposed in a pattern suitable to form a first row of the dectector mosaic at a first edge of the assembly and terminating at an interconnect location. Terminal pads are applied to each such interconnect line and the first thick film dielectric layer is deposited over the thin film interconnect line such that only the terminal pads are left exposed. Each alternating layer of thick film and thin film layers are similarly disposed to form a complete interconnect pattern suitable for interconnecting with the integrated circuit devices and a plurality of detector rows forming the detector mosaic interconnect lines. Bonding pads are applied to the detector mosaic such that the fill factor for detectors is about 100% for bonding pads on centers in the range of about 25 micrometers.

4601526, Jul 22, 1986

Aug 28, 1985

6/771141

William J. White - Chelmsford MA
James M. Ortolf - Acton MA
William R. Gordon - Burlington MA

Honeywell Inc. - Minneapolis MN

H01R 909, H01L 3904

339 17CF

An integrated circuit chip carrier having miniaturized electrical input/output interconnectors, such that the area of the chip carrier may be matched or minimized with respect to the area of the integrated circuit. Such input/output interconnectors are reusable, such that the chip carrier may be easily removed and reconnected to a mother board assembly. Input/output interconnections as provided which when used allow an electro-optical integrated circuit to become in focus.

4197633, Apr 15, 1980

Sep 1, 1977

5/829745

Robert V. Lorenze - Westford MA
William J. White - Chelmsford MA

Honeywell, Inc. - Minneapolis MN

B01J 1700

29577R

A hybrid mosaic IR/CCD focal plane structure has high detector element packing densities which may be achieved using cost effective planar processing technology. The focal plane structure preferably includes an insulator layer over a silicon substrate which contains integrated circuit CCD signal processing circuitry. A mosaic photovoltaic (Hg,Cd)Te detector array is fabricated on the insulator layer. The photosignals from the detector array are coupled to the CCD circuitry by thin film electrical interconnects together with contact pads which extend through the insulator layer and are exposed at the surface of the insulator layer.

4354109, Oct 12, 1982

Apr 17, 1981

6/254845

William J. White - Chelmsford MA
Jeffrey C. Gelpey - Peabody MA
Donald E. Marshall - Harvard MA

Honeywell Inc. - Minneapolis MN

G01J 100

250349

A mounting means for apparatus useful for processing infrared signals including a pyroelectric detector array with a plurality of detector elements, a plurality of electrically conductive epoxy polymer mounting means having two ends and attached at one end to the detector array to provide individual electrical contact for each of the detector elements. The apparatus further includes circuit means attached to the other end of the mounting means for processing electrical signals from the array.

4814620, Mar 21, 1989

Dec 1, 1987

7/127077

David M. Comey - Concord MA
Brian W. Denley - Melrose MA
William J. White - Chelmsford MA

Honeywell Inc. - Minneapolis MN

G01J 506

250352

A cold shield for an array of detectors of predetermined shape comprising a first cover of radiation blocking material formed with parallel rows of apertures and lying a first distance away from the detectors and a second cover of radiation blocking material formed with a plurality of apertures of generally the predetermined shape therethrough and lying a second distance, smaller than the first distance, away from the detectors so as to minimize background radiation from reaching the detectors while permitting desired radiation approaching the array from any of a plurality of angles to reach the detectors.

4615573, Oct 7, 1986

Nov 1, 1985

6/794179

William J. White - Chelmsford MA
James M. Ortolf - Acton MA

Honeywell Inc. - Minneapolis MN

H01R 909

339 17M

Apparatus and method for electrically interconnecting two integrated circuit boards, which includes spring finger contact pads positioned on one board which are matched to raised contact pads on a second board in a manner such that the assembly is easily disassembled and reconnectable and such that it provides for exact height registration between boards. Accurate height registration is required when, for example, an electro-optical device referenced with respect to an optical system is mounted on one of the circuit boards.

4188709, Feb 19, 1980

Jun 16, 1978

5/916035

Robert V. Lorenze - Westford MA
William J. White - Chelmsford MA

Honeywell Inc. - Minneapolis MN

B01J 1700

29577R

A double-sided mosaic focal plane for infrared detection includes a semiconductor substrate having first and second opposing surfaces. Infrared detectors are mounted on the first surface and solid state signal processing circuitry is formed in the semiconductor substrate proximate the second surface. Interconnect means extend through the semiconductor substrate to interconnect the infrared detectors with the solid state signal processing circuitry.

4570329, Feb 18, 1986

Aug 15, 1984

6/641075

Christopher G. Paine - Worcester MA
William J. White - Chelmsford MA
Susan J. Resnick - Great Neck NY

Honeywell Inc. - Minneapolis MN

H01L 2198, H01L 3118

29572

An apparatus and method for fabricating a backside contacted mosaic detector array which provides close detector packing in one or more directions by eliminating over the edge contacts typically used. The method uses indium or other coldweldable metal, both as a means for fastening the array from the backside to its circuit board and as a means for providing electrical contact with each detector.

4286278, Aug 25, 1981

Aug 16, 1979

6/067244

Robert V. Lorenze - Westford MA
William J. White - Chelmsford MA

Honeywell Inc. - Minneapolis MN

H01L 2714

357 30

A hybrid mosaic IR/CCD focal plane structure has high detector element packing densities which may be achieved using cost effective planar processing technology. The focal plane structure preferably includes an insulator layer over a silicon substrate which contains integrated circuit CCD signal processing circuitry. A mosaic photovoltaic (Hg,Cd)Te detector array is fabricated on the insulator layer. The photosignals from the detector array are coupled to the CCD circuitry by thin film electrical interconnects together with contact pads which extend through the insulator layer and are exposed at the surface of the insulator layer.