Inventors:
Siang Ping Kwok - Dallas TX
William F. Richardson - San Antonio TX
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 27108
US Classification:
257301, 257303, 257304, 257306, 257308, 257309, 257311
Abstract:
In one aspect, the invention encompasses a method of forming a capacitor. A mass is formed over an electrical node. An opening is formed within the mass. The opening has a lower portion proximate the node and an upper portion above the lower portion. The lower portion is wider than the upper portion. A first conductive layer is formed within the opening and along a periphery of the opening. After the first conductive layer is formed, a portion of the mass is removed from beside the upper portion of the opening while another portion of the mass is left beside the lower portion of the opening. A dielectric material is formed over the first conductive layer, and a second conductive layer is formed over the dielectric material. The second conductive layer is separated from the first conductive layer by the dielectric material. In another aspect, the invention encompasses a capacitor construction.