Inventors:
William J. Alexander - Pittsburgh PA, US
Assignee:
Solid State Measurements, Inc. - Pittsburgh PA
International Classification:
G06F 1750, G01R 3126, G01R 3100, H01L 2166
US Classification:
716 4, 324500, 324754, 438 17
Abstract:
A wafer testing apparatus comprises a sample chuck having a flat surface for supporting a test wafer positioned thereon, the sample chuck having a base structure manufactured of a conductive metal and having a semiconductor layer secured to the base structure defining the flat surface of the sample chuck, an electrical test probe establishing a correction factor corresponding to a location on the semiconductor layer surface to be used to report an electrical property at a location on a test wafer substantially unaffected by the electrical properties of the semiconductor layer and base structure below that location.