WILLIAM H LEAVITT
Engineering in Haverhill, MA

6744017, Jun 1, 2004

May 29, 2002

10/157664

William Leavitt - Haverhill MA
Christopher Berry - Exeter NH
Thomas Doyon - Manchester NH
David Sabo - Hollis NH

IBIS Technology Corporation - Danvers MA

F27B 514

219390, 219405, 219411, 392416, 392418, 118724, 118725, 118 501

The present invention provides a heating assembly that includes a thermally conductive, lamp-mounting block manufactured from aluminum or a similar material, which can be machined as a single-piece (e. g. , unibody) block. The unibody block includes one or more networks of inner passageways bored or otherwise machined within the block for transporting one or more cooling fluids. The mounting block can also have a reflective coating on one or more of its surfaces that face the lamps to efficiently reflect heat and/or light generated by the lamps onto a desired surface, for example, a semiconductor wafer. Thermal isolation devices, e. g. , pads, provide for both physical mounting of the heating lamps to the mounting block and also provide thermal isolation between the heating lamp and its electrical connections are also disclosed to protecting heat-sensitive elements of the heating assembly such as seals.

6815696, Nov 9, 2004

May 29, 2002

10/157947

Steven Richards - Georgetown MA
Christopher Berry - Exeter NH
William Leavitt - Haverhill MA

Ibis Technology Corporation - Danvers MA

H01L 2100

25049221, 438694, 438667

The present invention provides a beam stop for use in an ion implantation system that includes a base formed of a thermally conductive material, and a heat transfer layer formed of a semi-elastic material that is disposed on a surface of the base. The beam stop further includes one or more tiles, each formed of a thermally conductive refractory material, that are disposed on the semi-elastic layer so as to face an ion beam in the implantation system. The heat transfer layer transfers heat generated in the tile in response to ion beam impact to the base. The base in turn can be coupled to a heat sink to remove heat from the base. The thickness and the thermal conductivity of the base, and those of the heat transfer layer and the tile are chosen so as to ensure uniform expansion of the base and the tile when the beam stop is heated by ion beam impact.

6794662, Sep 21, 2004

Oct 7, 2003

10/680829

William Leavitt - Haverhill MA
Steven Richards - Georgetown MA
Julian G. Blake - Gloucester MA

Ibis Technology Corporation - Danvers MA

H01J 3720

25049221, 25044011, 25044211

Wafer-holding structures formed from thermosetting resins are disclosed for use in semiconductor processing including, for example, SIMOX wafer processing. In one embodiment a pin is disclosed that is adapted to receive a wafer edge, and is coupled with a wafer holder assembly. The pin can be filled with a conductive material to provide an electrical pathway between the wafer and the wafer holder assembly, which can be coupled to a ground. This arrangement provides a conductive path for inhibiting electrical discharges from the wafer during the ion implantation process. The pin exhibits thermal isolation characteristics and sufficient hardness so as to not effect localized thermal dissipation of the wafer, yet is sufficiently soft so as to not mark or otherwise damage the wafer.

6114705, Sep 5, 2000

Sep 10, 1997

8/927503

William Leavitt - Haverhill MA
David Holbrook - Lexington MA

Varian Semiconductor Equipment Associates, Inc. - Gloucester MA

G21K 510, H01J 3930

25044211

A system for correcting eccentricity and rotational error of a substantially circular workpiece, in which the workpiece is moved to a workstation, using a translating device. The rotational position and position of the workpiece center is determined. There is a rotatable member at the workstation, having a home position and a center. The rotatable member is pre-rotated from its home position an amount sufficient to correct workpiece rotational error. The translating device is caused to place the workpiece on the rotatable member such that the workpiece center is at a known position relative to the center of the rotatable member, to correct eccentricity. The rotatable member is then rotated back to its home position, to correct rotational error.

6863736, Mar 8, 2005

May 29, 2002

10/157687

William Leavitt - Haverhill MA, US
Richard Muka - Topsfield MA, US
Steven Richards - Georgetown MA, US

Ibis Technology Corporation - Danvers MA

H01L021/00, C23C016/00

118730, 118715, 118733, 118500, 2504921, 15634555, 165177

The present invention provides a rotating shaft that can extend between two regions having different ambient pressures. The rotating shaft can include a rotatable hollow outer shell that is coupled to a proximal portion of an inner shaft with a limited number of contact points. A plurality of thermal breaks disposed between the inner shaft and the hollow outer shell impede heat transfer between these two components. A rotary seal coupled to the distal portion of the inner shaft preserves the pressure differential between the two regions. Further, a heat sink removes heat transferred to the seal to ensure that the temperature of the seal remains within a range suitable for its operation. The rotating shaft of the invention can be utilized, for example, in an ion implantation system by the coupling of the outer shell to a wafer holder to position and orient a wafer in a path of an ion beam.

8426829, Apr 23, 2013

Sep 30, 2010

12/894229

William H Leavitt - Haverhill MA, US
Theodore H Smick - Essex MA, US
Joseph Daniel Gillespie - Boston MA, US
William H Park - Somerville MA, US
Paul Eide - Stratham NH, US
Drew Arnold - Salem MA, US
Geoffrey Ryding - Manchester MA, US

GTAT Corporation - Nashua NH

H01J 37/317

25044211, 2504431

An ion implanter has an implant wheel with a plurality of wafer carriers distributed about a periphery of the wheel. Each wafer carrier has a heat sink for removing heat from a wafer on the carrier during the implant process by thermal contact between the wafer and the heat sink. The wafer carriers have wafer retaining fences formed as cylindrical rollers with axes in the respective wafer support planes of the wafer carriers. The cylindrical surfaces of the rollers provide wafer abutment surfaces which can move transversely to the wafer support surfaces so that no transverse loading is applied by the fences to wafer edges as the wafer is pushed against the heat sink by centrifugal force. The wafer support surfaces comprise layers of elastomeric material and the movable abutment surfaces of the fences allow even thermal coupling with the heat sink over the whole area of the wafer.

2007019, Aug 30, 2007

Feb 28, 2007

11/680154

William Leavitt - Haverhill MA, US
Steven Richards - Georgetown MA, US

IBIS TECHNOLOGY CORPORATION - Danvers MA

H01L 21/306

156345110

Wafer-holding structures formed from thermosetting resins are disclosed for use in semiconductor processing including, for example, SIMOX wafer processing. At least a portion of the distal portion of the holder comprises graphite, thereby reducing wafer rotation during implantation while maintaining the desired overall thermal signature provided by the thermosetting resin. In one embodiment a pin is disclosed that is adapted to receive a wafer edge, and is coupled with a wafer holder assembly. The pin can be filled with a conductive material to provide an electrical pathway between the wafer and the wafer holder assembly, which can be coupled to a ground. This arrangement provides a conductive path for inhibiting electrical discharges from the wafer during the ion implantation process. The pin exhibits thermal isolation characteristics and sufficient hardness so as to not effect localized thermal dissipation of the wafer, yet is sufficiently soft so as to not mark or otherwise damage the wafer.