Inventors:
Sheldon H. Butt - Godfrey IL
William F. Cann - Ladue MO
Assignee:
Olin Corporation - New Haven CT
International Classification:
H01L 2308
Abstract:
A semiconductor casing is formed of a ceramic-glass-metal composite material with a leadframe embedded in a base component. The leadframe may include holes therethrough to mechanically interlock with the composite material. Also, a process comprises forming a four-sided semiconductor casing having a leadframe with an aluminum cladding that is etched away at the ends extending from the casing.