WILLIAM F CANN
Architects in Saint Louis, MO
License number
Massachusetts 1362
Type
Architect
Address
Address
Saint Louis, MO 63139
Professional information
Ceramic-Glass-Metal Packaging For Electronic Components Incorporating Unique Leadframe Designs
US Patent:
4761518, Aug 2, 1988
Filed:
Jan 20, 1987
Appl. No.:
7/004469
Inventors:
Sheldon H. Butt - Godfrey IL
William F. Cann - Ladue MO
William F. Cann - Ladue MO
Assignee:
Olin Corporation - New Haven CT
International Classification:
H01L 2308
US Classification:
174 52FP
Abstract:
A semiconductor casing is formed of a ceramic-glass-metal composite material with a leadframe embedded in a base component. The leadframe may include holes therethrough to mechanically interlock with the composite material. Also, a process comprises forming a four-sided semiconductor casing having a leadframe with an aluminum cladding that is etched away at the ends extending from the casing.