William Ervin Grant
Engineers at Hemlock, Santa Ana, CA
License number
Colorado 11257
Issued Date
Sep 30, 1972
Renew Date
Oct 12, 1993
Expiration Date
Oct 12, 1993
Type
Professional Engineer
Address
Address
2217 W Hemlock St W. HEMLOCK, Santa Ana, CA 92704
Professional information
Low Cost Power Semiconductor Module Without Substrate
US Patent:
6703703, Mar 9, 2004
Filed:
Jan 11, 2001
Appl. No.:
09/758822
Inventors:
William Grant - Fountain Valley CA
Assignee:
International Rectifier Corporation - El Segundo CA
International Classification:
H01L 2348
US Classification:
257688, 257680, 257687, 257693, 257709, 257730, 257712
Abstract:
A power module for low voltage applications, which does not include an insulated metal substrate is disclosed. The module includes a power shell and a plurality of lead frames each lead frame including a conductive pad on which one or more MOSFETs may be electrically mounted. The MOSFETs are electrically connected via wire bonds.
Power Module
US Patent:
6441520, Aug 27, 2002
Filed:
Sep 12, 2000
Appl. No.:
09/660305
Inventors:
William Grant - Fountain Valley CA
Assignee:
International Rectifier Corporation - El Segundo CA
International Classification:
H02K 1100
US Classification:
310 68R, 174252, 361709, 361712, 361719, 361715
Abstract:
A power module for a motor in which the module is arranged to house both the high power devices needed to drive the phase windings of the motor and the control electronics needed to control the operation of the high power devices. The components are arranged such that the thermal energy generated by the high power devices is directed away from the control electronics for subsequent dissipation. An insulated metal substrate is used as the base of the module for directing the thermal energy. Further, the module components can be easily assembled through the use of solderless resilient connections from the control electronics to the other components in the module. The module employs a base, a power shell coupled to the base, and a circuit board positioned within the internal chamber of the power shell. The power shell has a plurality of walls forming an internal chamber and at least one conductive region. At least one electronic device is mounted to the conductive region.
Electronic Half Bridge Module
US Patent:
6212087, Apr 3, 2001
Filed:
Jan 31, 2000
Appl. No.:
9/494563
Inventors:
William Grant - Fountain Valley CA
Joshua Polack - Glendale CA
Joshua Polack - Glendale CA
Assignee:
International Rectifier Corp. - El Segundo CA
International Classification:
H02M 100
US Classification:
363144
Abstract:
A metal oxide semiconductor (MOSFET) half bridge module for use in a 42 volt internal combustion engine starter/alternator circuit. The module is a compact, high power handling device which has an extremely low inductance. This low inductance module supports the current and current slew rates necessary to properly operate in an internal combustion engine starter/alternator circuit across a wide temperature range. The module has a thermally conductive base. A plurality of lower circuit boards are adjacently positioned within the base along the same plane. At least one semiconductor device has a first surface, the first surface of the semiconductor device is mounted to one of the plurality of circuit boards. A common terminal has planar portion which is coupled to each of the plurality of lower circuit boards. An upper circuit board is in electrical contact with the plurality of lower circuit boards and includes a connector providing external access for drive signals for the semiconductor device.
Module For Solid State Relay For Engine Cooling Fan Control
US Patent:
7187551, Mar 6, 2007
Filed:
Aug 12, 2004
Appl. No.:
10/916896
Inventors:
Sergio Fissore - Redondo Beach CA, US
William Grant - Fountain Valley CA, US
William Grant - Fountain Valley CA, US
Assignee:
International Rectifier Corporation - El Segundo CA
International Classification:
H05K 7/20
US Classification:
361702, 361704, 361719, 257706, 257713, 257718, 165 80, 165 3, 310 68 R, 310 68 D
Abstract:
A power module that includes a lead frame having conductive pads molded in at the base thereof and a heatsink in thermal contact with the conductive pads through a thermally conductive adhesive.
Low Cost Power Semiconductor Module Without Substrate
US Patent:
7122890, Oct 17, 2006
Filed:
Aug 6, 2003
Appl. No.:
10/635359
Inventors:
William Grant - Fountain Valley CA, US
Assignee:
International Rectifier Corporation - El Segundo CA
International Classification:
H01L 23/04, H01L 23/12, H01L 23/10, H01L 23/34
US Classification:
257698, 257700, 257706, 257724
Abstract:
A power module for low voltage applications, which does not include an insulated metal substrate is disclosed. The module includes a power shell and a plurality of lead frames each lead frame including a conductive pad on which one or more MOSFETs may be electrically mounted. The MOSFETs are electrically connected via wire bonds.
Low Cost Power Semiconductor Module Without Substrate
US Patent:
7545033, Jun 9, 2009
Filed:
Jul 28, 2006
Appl. No.:
11/495107
Inventors:
William Grant - Fountain Valley CA, US
Assignee:
International Rectifier Corporation - El Segundo CA
International Classification:
H01L 23/10, H01L 23/34
US Classification:
257706, 257707, 257E23079, 257E23103
Abstract:
A power module for low voltage applications, which does not include an insulated metal substrate is disclosed. The module includes a power shell and a plurality of lead frames each lead frame including a conductive pad on which one or more MOSFETs may be electrically mounted. The MOSFETs are electrically connected via wire bonds.
Fan Control Circuit And Package
US Patent:
6912134, Jun 28, 2005
Filed:
Sep 12, 2001
Appl. No.:
09/949764
Inventors:
William R. Grant - Fountain Valley CA, US
Sergio Fissore - Redondo Beach CA, US
Sergio Fissore - Redondo Beach CA, US
Assignee:
International Rectifier Corporation - El Segundo CA
International Classification:
H05K007/02, H05K007/06, H05K007/08, H05K007/10
US Classification:
361760, 361361, 361813, 257666
Abstract:
A dual output power module housing a dual output power circuit for providing variable power to two parallel connected fan motors is shown. The power module includes a pad which has disposed thereon two power switching devices, two intelligent power switches, and a power circuit board on which circuits for controlling the intelligent power switches are disposed. The module includes a power shell that surrounds the dual output power circuit, and a resilient, flexible enclosure which encapsulates the power shell and the circuit components within the power shell.
Power Module Housing
US Patent:
D456772, May 7, 2002
Filed:
Apr 11, 2001
Appl. No.:
29/140067
Inventors:
William Grant - Fountain Valley CA
Sergio Fissore - Redondo Beach CA
Sergio Fissore - Redondo Beach CA
Assignee:
International Rectifier Corporation - El Segundo CA
International Classification:
0302
US Classification:
D13110
Semiconductor Half-Bridge Module With Low Inductance
US Patent:
2006029, Dec 28, 2006
Filed:
Jun 26, 2006
Appl. No.:
11/474714
Inventors:
William Grant - Fountain Valley CA, US
Heny Lin - Irvine CA, US
Jack Marcinkowski - San Pedro CA, US
Velimir Nedic - Los Angeles CA, US
Heny Lin - Irvine CA, US
Jack Marcinkowski - San Pedro CA, US
Velimir Nedic - Los Angeles CA, US
International Classification:
G09G 5/00, H01L 29/76
US Classification:
345204000, 257343000, 257734000, 361637000
Abstract:
A power module that includes embedded power bus bars and output bus arranged to lower the parasitic inductance.
Power Module
US Patent:
6166464, Dec 26, 2000
Filed:
Aug 17, 1999
Appl. No.:
9/375716
Inventors:
William Grant - Fountain Valley CA
Assignee:
International Rectifier Corp. - El Segundo CA
International Classification:
H02K 1100
US Classification:
310 68R
Abstract:
A power module for a motor in which the module is arranged to house both the high power devices needed to drive the phase windings of the motor and the control electronics needed to control the operation of the high power devices. The components are arranged such that the thermal energy generated by the high power devices is directed away from the control electronics for subsequent dissipation. An insulated metal substrate is used as the base of the module for directing the thermal energy. Further, the module components can be easily assembled through the use of solderless resilient connections from the control electronics to the other components in the module. The module employs a base, a power shell coupled to the base, and a circuit board positioned within the internal chamber of the power shell. The power shell has a plurality of walls forming an internal chamber and at least one conductive region. At least one electronic device is mounted to the conductive region.