William D. Jordan
Engineering at Pallos Verdas Dr, Dallas, TX

5428897, Jul 4, 1995

Sep 29, 1994

8/314673

William D. Jordan - Dallas TX
Matthew C. Smithers - Lewisville TX

Thermalloy, Inc. - Dallas TX

B21D 3900, B23P 1526

2989003

A mounting spring clamp for securing a heat sink to a device package is secured to the heat sink by positioning the central body portion of the spring clamp in an attachment clip. The clip is compressed and positioned in a groove of the heat sink. The clip comprises a semi-circular shaped seat with ears extending from both sides of the seat and is made from a flexible material. Compression of the ears reduces the seat diameter, thereby trapping the spring's central body, and also creates spring force in the ears, thereby trapping the clip between the fins of the heat sink. The mounting spring has an elongated body with ends extending from the axis of its central body. The ends may be trapped or hooked in appropriate receivers on a frame or socket holding an electronic device package to secure the heat sink adjacent the device package.

3970851, Jul 20, 1976

May 20, 1975

5/579167

William D. Jordan - Dallas TX

The United States of America as represented by the Secretary of the Army - Washington DC

G01J 302, F17C 700

250352

A detector of an infrared telescope that must be cooled to near 20. degree4. degree. K in order to function properly is cooled by spraying a liquid cryogenic fluid through a small nozzle into a vented chamber of subatmospheric pressure to cause the pressure of the cryogenic fluid to be dropped below its fluid triple point pressure and thereby freeze to deposit frozen crystals on the detector and thereby cool the detector to the required temperature for proper functioning of the detector. The frozen crystals deposited on the detector will be sublimed therefrom by the heat leaked and generated in the detector.

4847449, Jul 11, 1989

Jun 16, 1988

7/207645

William D. Jordan - Dallas TX
Donald L. Clemens - The Colony TX

Thermalloy Incorporated - Dallas TX

H05K 720

174138G

Alignment apparatus for receiving, aligning and retaining the pin connectors of an electronic component package in predetermined relationship is used to maintain proper alignment of the pin connectors with preformed holes or mounting pads on a printed circuit board or the like when the sub-assembly of a heat sink and an electronic component package is mounted on a printed circuit board or the like.

5844312, Dec 1, 1998

Jan 20, 1997

8/786408

Howard G. Hinshaw - Dallas TX
William D. Jordan - Dallas TX
Matthew Smithers - Lewisville TX

Thermalloy, Inc. - Dallas TX

H01L 2334

257718

A clip secures a heat sink having a slot with grooves on opposing sides thereof to a transistor. The frame has sides with a width therebetween which can be wedged into grooves on opposing sides of a slot in the heat sink. A portion of the frame is raised up between two parallel cuts in the frame. A transistor is wedged under the raised up portion. The clip has legs which are insertable into a printed circuit board for easy assembly of a heat sink, transistor, clip and printed circuit board.

3970850, Jul 20, 1976

May 20, 1975

5/579168

William D. Jordan - Dallas TX

The United States of America as represented by the Secretary of the Army - Washington DC

G01J 302, F17C 700

250352

An infrared telescope that has a detector therein that must be cooled to r 20. degree. K in order to function properly is cooled by freezing a pool of liquid cryogen through rapid venting of a chamber containing the cryogen to a low pressure to cause the cryogen to freeze by the pressure of the liquid cryogen being dropped below the fluid triple point pressure. In this way, the frozen pool of liquid cryogen which is in contact with the detector maintains the detector in a cooled and operating range.

5422789, Jun 6, 1995

Nov 2, 1993

8/146323

Francis E. Fisher - Swindon, GB
Robin D. Johnson - Bath, GB
William D. Jordan - Dallas TX

Redpoint Thermalloy Limited

H05K 720

361719

A sheet metal device for mounting a component on a circuit board is formed by stamping to defining a head portion and a base portion. The head portion is formed for insertion into a slot in a component such as a heat sink and the base portion is formed for insertion into a printed circuit board. The head portion has spade-form members which engage the walls of the slot and retain the head portion in the slot. The component is mounted on a printed circuit board by inserting the base portion into an aperture in the printed circuit board and soldering the base portion to the reverse surface of the board.

4625260, Nov 25, 1986

Aug 24, 1984

6/644038

William D. Jordan - Dallas TX
Donald L. Clemens - The Colony TX

Thermalloy Incorporated - Dallas TX

H05K 720

361386

A fastener is provided for mounting a heat sink to the surface of a circuit board. The fastener includes a body having structure extending from the body for engaging the heat sink. The body further includes structure extending in a direction opposite the engaging structure for contacting the surface of the circuit board. The contacting structure includes a surface parallel to the surface of the circuit board and is coated with a solder-promoting material for surface mounting the heat sink to the circuit board.

5038858, Aug 13, 1991

Mar 13, 1990

7/492926

William D. Jordan - Dallas TX
Donald L. Clemens - The Colony TX

Thermalloy Incorporated - Dallas TX

F28F 700, H02B 156, H05K 720

165185

A finned heat sink is constructed from a base having parallel grooves with a latching lip. The fins are individually formed with a retaining boss adjacent one edge which is adapted to mate with the latching lip to secure the fin in the groove. Spacing tabs are formed on the fins to assure uniform parallel spacing between the fins when assembled.

5386338, Jan 31, 1995

Dec 20, 1993

8/169354

William D. Jordan - Dallas TX
Matthew C. Smithers - Lewisville TX

Thermalloy, Inc. - Dallas TX

H05K 720

361704

A mounting spring clamp for securing a heat sink to a device package is secured to the heat sink by positioning the central body portion of the spring clamp in an attachment clip. The clip is compressed and positioned in a groove of the heat sink. The clip comprises a semi-circular shaped seat with ears extending from both sides of the seat and is made from a flexible material. Compression of the ears reduces the seat diameter, thereby trapping the spring's central body, and also creates spring force in the ears, thereby trapping the clip between the fins of the heat sink. The mounting spring has an elongated body with ends extending from the axis of its central body. The ends may be trapped or hooked in appropriate receivers on a frame or socket holding an electronic device package to secure the heat sink adjacent the device package.

4403102, Sep 6, 1983

Oct 23, 1981

6/314202

William D. Jordan - Dallas TX
Roger C. Hundt - Carrollton TX
James D. Pritchett - Garland TX

Thermalloy Incorporated - Dallas TX

H01B 734, H05K 334

174 16HS

Disclosed are methods and apparatus for attaching a heat sink mounted semiconductor case to a circuit board employing a stud with a flange near one end. The longer shank is threaded and at least the shorter shank or head stud is tin-plated. The stud may be swaged into a mounting hole in the heat sink and the heat sink and semiconductor case pre-assembled. The pre-assembled unit may then be mounted and soldered to the circuit board along with other circuit components.