WEI WANG
Medical Practice at Holland Ave, Albany, NY
License number
Florida 97423
Issued Date
Nov 13, 2006
Effective Date
Nov 13, 2006
Expiration Date
Jan 31, 2019
Category
Health Care
Type
Medical Doctor
Address
Address
113 Holland Ave, Albany, NY 12208
Professional information
Wei Wang
Location:
Albany, New York Area
Industry:
Computer Hardware
Work:
SUNY at Albany
Jan 2009 - Sep 2010
-
Professor
University at Albany
Jan 2006 - Dec 2008
-
Senior Scientist
Education:
Concordia University 1997 - 2002
Passivated Copper Conductive Layers For Microelectronic Applications And Methods Of Manufacturing Same
US Patent:
5766379, Jun 16, 1998
Filed:
Jun 7, 1995
Appl. No.:
8/478491
Inventors:
William A. Lanford - Malden Bridge NY
Wei Wang - Albany NY
Peijun Ding - San Jose CA
Wei Wang - Albany NY
Peijun Ding - San Jose CA
Assignee:
The Research Foundation of State University of New York - Albany NY
International Classification:
C22F 3806, C22F 3816
US Classification:
148537
Abstract:
A copper conductor is formed which is included as a component in microelectronic devices. The conductor is formed by forming a metal layer on the surface of a microelectronic substrate, forming a copper layer on the metal layer, and annealing the metal and copper layers. The annealing step diffuses at least some of the metal layer through the copper layer to the surface thereof where the diffused metal forms a protective metal oxide at the surface of the copper layer. As a result, the metal oxide layer passivates the copper layer.
Passivated Copper Conductive Layers For Microelectronic Applications
US Patent:
6057223, May 2, 2000
Filed:
Feb 10, 1998
Appl. No.:
9/021666
Inventors:
William A. Lanford - Malden Bridge NY
Wei Wang - Albany NY
Peijun Ding - San Jose CA
Wei Wang - Albany NY
Peijun Ding - San Jose CA
Assignee:
The Research Foundation of State University of New York - Albany NY
International Classification:
H01L 214763
US Classification:
438618
Abstract:
A copper conductor is formed which is included as a component in microelectronic devices. The conductor is formed by forming a metal layer on the surface of a microelectronic substrate, forming a copper layer on the metal layer, and annealing the metal and copper layers. The annealing step diffuses at least some of the metal layer through the copper layer to the surface thereof where the diffused metal forms a protective metal oxide at the surface of the copper layer. As a result, the metal oxide layer passivates the copper layer.