WEI GAO
Broker in Acton, MA
License number
Massachusetts 9526279
Issued Date
Feb 28, 2013
Expiration Date
Mar 18, 2017
Type
Salesperson
Address
Address
Acton, MA 01720
Professional information
Wei Gao - Acton, MA
Work:
Zenitac Technologies
Managing Director Precision Digital Corp
VP of Sales and Marketing - Asia Axcel Photonics, Inc - Marlborough, MA
Founder, Senior Executive Axcel Photonics, Inc
founder Nortel Networks
Application Engineer Multiplex, Inc
Founding Employee Corning Lasertron - Bedford, MA
Senior Engineer, Lasertron (later
Managing Director Precision Digital Corp
VP of Sales and Marketing - Asia Axcel Photonics, Inc - Marlborough, MA
Founder, Senior Executive Axcel Photonics, Inc
founder Nortel Networks
Application Engineer Multiplex, Inc
Founding Employee Corning Lasertron - Bedford, MA
Senior Engineer, Lasertron (later
Education:
University of Delaware - Newark, DE
Ph.D. in Electrical Engineering Chinese Academy of Sciences and Beijing Jiao Tong University
Master in Electrical Engineering
Ph.D. in Electrical Engineering Chinese Academy of Sciences and Beijing Jiao Tong University
Master in Electrical Engineering
Powerpack Laser Diode Assemblies
US Patent:
6870866, Mar 22, 2005
Filed:
Jun 5, 2001
Appl. No.:
09/874501
Inventors:
Wei Gao - Acton MA, US
Assignee:
Axcel Photonics, Inc. - Marlborough MA
International Classification:
H01S003/04
US Classification:
372 34, 372 36
Abstract:
In one aspect, the invention provides a laser diode assembly, comprising a carrier, a laser diode, a first bonding member, and a second bonding member. The carrier has a conductive layer formed thereon that is sized for attaching at least two bonding members thereto. The laser diode is operably coupled to the carrier and has first and second conductive pads formed thereon. The first and second conductive pads are each sized for attaching at least one bonding member thereto. The first bonding member couples the first conductive pad to the conductive layer of the carrier, and the second bonding member couples the second conductive pad to the conductive layer of the carrier.