WADE LESLIE HOOKER
Pilots at Pinecrest Rd, Endicott, NY
License number
New York A2701381
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
600 Pinecrest Rd, Endicott, NY 13760
Professional information
Cooling Method For Electronic Components
US Patent:
6453537, Sep 24, 2002
Filed:
Nov 10, 1999
Appl. No.:
09/431751
Inventors:
Craig G. Heim - Kirkwood NY
Wade Leslie Hooker - Endicott NY
Ajit Kumar Trivedi - Endicott NY
Wade Leslie Hooker - Endicott NY
Ajit Kumar Trivedi - Endicott NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B23P 1902
US Classification:
294264, 29739, 294261, 29832, 294028, 228119, 228264, 257715, 361719, 361700, 16510421, 165185, 174 163, 174252
Abstract:
A method for cooling electrical components on a substrate during a rework process. A block of a porous, thermally conductive material, saturated with a liquid, is positioned on an electrical component to be cooled. During the rework processing of an adjacent electrical component, the liquid in the porous, thermally conductive block vaporizes, thereby maintaining the temperature of the electrical component below its reflow temperature. A second thermally conductive block, in thermal contact with the porous, thermally conductive block, and the substrate on which the electronic component to be cooled is attached, is positioned between the electronic component to be cooled and the electronic component undergoing rework. A supply of liquid is provided to the porous, thermally conductive block to maintain the temperature of the electronic component to be cooled at a predetermined level for a specified period of time.
Cooling Structure For Electronic Components
US Patent:
6034875, Mar 7, 2000
Filed:
Jun 17, 1998
Appl. No.:
9/098977
Inventors:
Craig G. Heim - Kirkwood NY
Wade Leslie Hooker - Endicott NY
Ajit Kumar Trivedi - Endicott NY
Wade Leslie Hooker - Endicott NY
Ajit Kumar Trivedi - Endicott NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 720
US Classification:
361719
Abstract:
A method and apparatus for cooling electrical components on a substrate during a rework process. A block of a porous, thermally conductive material, saturated with a liquid, is positioned on an electrical component to be cooled. During the rework processing of an adjacent electrical component, the liquid in the porous, thermally conductive block vaporizes, thereby maintaining the temperature of the electrical component below its reflow temperature. A second thermally conductive block, in thermal contact with the porous, thermally conductive block, and the substrate on which the electronic component to be cooled is attached, is positioned between the electronic component to be cooled and the electronic component undergoing rework. A supply of liquid is provided to the porous, thermally conductive block to maintain the temperature of the electronic component to be cooled at a predetermined level for a specified period of time.