VINH AI NGUYEN
Nail Technician in San Jose, CA

6507207, Jan 14, 2003

Feb 20, 2001

09/789600

Vinh T. Nguyen - San Jose CA 95123

G01R 3102

324761, 324754

An improved contact probe pin for wafer probing apparatus including an elongated metal conductor having a connector (or proximal) end, a center or medial section coated with an elastic material, and a contact pad engaging tip end. At least a portion of the center section of the probe pin is coated with a poorly conductive, but highly elastic material so as to enhance its flex characteristics. The coating may uniformly cover a portion of the center section of the probe pin or it may take on a predetermined pattern or shape. The coating may also unevenly cover a portion of the center section of the probe pin. The coating is selected such that it augments or enhances the resiliency of the pin and causes it to have a predetermined stress-strain profile with vertical (or Z-axis) displacement, and thus enables it to have predetermined probe pin tip contact force characteristics.

8338712, Dec 25, 2012

Dec 15, 2010

12/969478

Vinh T. Nguyen - San Jose CA, US
Claude A. S. Hamrick - Lincoln CA, US

H05K 1/00

174250

A multilayer circuit device having electrically isolated tightly spaced electrical current carrying traces and including a first nonconductive substrate having a first conductive material affixed to a first side thereof to form a first ground plane, a plurality of elongated first conductive traces formed on a second side of the first non-conductive substrate and having transverse widths of 50 microns or less and rising above the upper surface of the first substrate to a height equal to or greater than the widths thereof such that a transverse cross section of the first conductive traces has a height-to-width ratio equal to or exceeding 1, adjacent ones of the first traces being separated from each other by first elongated spaces, the first conductive traces being variously useful as ground lines, signal lines and/or power lines.

7874065, Jan 25, 2011

Oct 31, 2008

12/263416

Vinh T. Nguyen - San Jose CA, US
Claude A. S. Hamrick - San Jose CA, US

H05K 3/36

29830, 29840, 29846, 29852, 427 971, 427 972

A process for making a multi-layered circuit board having electrical current traces includes providing a substrate having a 1layer of conductive material to form a ground plane, plurality of metallic 1traces on a 2side of the substrate having widths of approximately 25 microns or less, developing 1ribs of photoresist forming 1walls rising above upper surface of an adjacent seed layer trace, depositing 1conductive signal traces having a thickness exceeding 25 microns into channels and over seed layer traces and stripping the ribs to leave 1conductive traces having a height-to-transverse ratio exceeding 1.