Inventors:
John Adams - Escondido CA
Juan Amoroso - San Diego CA
Paul Axford - La Jolla CA
Phil Bowles - Encinitas CA
Mike Juha - Del Mar CA
Van Nguyen - San Diego CA
Charles Preskitt - La Jolla CA
Ed Ross - Escondido CA
Doug Thompson - San Diego CA
Paul Turner - San Diego CA
Assignee:
ThermoSpectra Corporation - Franklin MA
International Classification:
G06F 1546
Abstract:
A method and apparatus for measuring structural characteristics of a manufactured circuit board containing solder joints by automated real-time digital X-ray radiographic inspection techniques. A circuit board under examination is automatically positioned by a digitally controlled multi-axis positioning system between an electronic X-ray source and an electronic X-ray imaging system, X-rays, in a beam of X-rays from the X-ray source, are directed towards the circuit board. The X-rays are absorbed, scattered and transmitted through the circuit board. The X-rays transmitted through the circuit board are directed upon the X-ray imaging system. The X-ray imaging system converts the transmitted X-rays into digital images which represent the radiographic density of the portion of the circuit board under examination. The digital images are stored within a digital image processor. A computer, under program control, performs calculational measurements on the digital images so as to measure the structural characteristics of the solder joints and components on the circuit board.