Inventors:
Leonard Olmer - Orlando FL, US
Thomas Lahey - Windermere FL, US
Timothy Campbell - Allentown PA, US
Robert Schanzer - Orlando FL, US
David Shuttleworth - Orlando FL, US
International Classification:
B05D001/36, B05D007/00, H01L021/4763, H01L021/31, H01L021/469
US Classification:
438763000, 427419300, 438761000, 438781000, 438784000
Abstract:
A method for improving throughput in a semiconductor wafer deposition process in a high density plasma chamber includes processing a first wafer in the high density plasma chamber using a process that includes high power sufficient to burn fluorosilicate glass residue in the chamber. The method further includes removing the first wafer and processing additional wafers using the same process without cleaning the chamber between wafers.