THU LE NGUYEN, DH
Dental Hygienist at Monterey Hwy, San Jose, CA

2007025, Nov 8, 2007

May 2, 2006

11/415705

James Roland - Fort Collins CO, US
Ray Parkhurst - Hillsboro OR, US
Ashish Alawani - San Jose CA, US
Marshall Maple - Cupertino CA, US
Thu Nguyen - San Jose CA, US

H01L 21/00

257778000, 438108000

An electronic package. The electronic package includes an electronic component having a heat producing device, an attachment piece, and at least two attachment units. Each unit includes an attachment pillar having a mating surface, a solder layer formed on the mating surface, and an attachment pad located on the attachment piece. The pillar of each unit is attached to its unit attachment pad via its unit solder layer and is otherwise attached to the electronic component. One pillar at least partially covers the heat producing device. Prior to attachment of pillars to their associated unit pads, the unit solder layer of the pillar at least partially covering the heat producing device is patterned to cover less than its mating surface, and the pillar at least partially covering the heat producing device is thermally connected to the heat producing device and to its unit attachment pad via its unit solder layer.

6122566, Sep 19, 2000

Mar 3, 1998

9/033822

Thu Nguyen - San Jose CA
Michal Lavi - San Jose CA

Applied Materials Inc. - Santa Clara CA

G06F 700

700218

A method and apparatus for controlling a multiple chamber semiconductor wafer processing system. The processing system includes a plurality of process chambers about the periphery of the transfer chamber. A centrally located wafer transfer mechanism effects moving wafers between the process chambers. The process sequencer control is a real time, multi-tasking control program having a presequencer or look ahead feature for preventing delays in the processing. In one implementation, the look ahead feature identifies mid-sequence or oriented wafers which cannot be further processed because their destination chamber is busy. Rather than expend system resources waiting for the destination chamber to become available, the wafers are transferred to a holding position, preferably the load lock, and rescheduled at the earliest time to finish their processing.

6168672, Jan 2, 2001

Mar 6, 1998

9/036333

Thu Van Nguyen - San Jose CA

Applied Materials Inc. - Santa Clara CA

B08B 704, B08B 300, B08B 304, B44C 122

134 18

A semiconductor wafer processing system with a multi-tasking sequencer control that performs an automatic cleaning process for the process chamber or chambers of the system.

7961255, Jun 14, 2011

Feb 6, 2009

12/367425

David A. Baer - San Jose CA, US
Jeff Tingley - San Jose CA, US
Aleksandr Movshovich - Santa Clara CA, US
Brad Grossman - Sunnyvale CA, US
Brian F. Schoner - Fremont CA, US
Chengfuh Jeffrey Tang - Saratoga CA, US
Chuck Monahan - Mountain View CA, US
Darren D. Neuman - Palo Alto CA, US
David Chao Hua Wu - San Diego CA, US
Francis Cheung - Del Mar CA, US
Greg A. Kranawetter - Laguna Hills CA, US
Hoang Nhu - Irvine CA, US
Hsien-Chih Jim Tseng - San Jose CA, US
Iue-Shuenn Chen - San Diego CA, US
James D. Sweet - Sunnyvale CA, US
Jeffrey S. Bauch - Alpharetta GA, US
Keith LaRell Klinger - San Diego CA, US
Patrick Law - Cupertino CA, US
Rajesh Mamidwar - San Diego CA, US
Dan Simon - San Diego CA, US
Sang Van Tran - Encinitas CA, US
Shawn V. Johnson - Laguna Hill CA, US
Steven T. Jaffe - Irvine CA, US
Thu T. Nguyen - San Jose CA, US
Ut Nguyen - San Diego CA, US
Yao-Hua Steven Tseng - Fremont CA, US
Brad Delanghe - Sunnyvale CA, US
Ben Giese - Oceanside CA, US
Jason Demas - Irvine CA, US
Lakshman Ramakrishnan - Banglore, IN
Sandeep Bhatia - Bangalore, IN
Guang-Ting Shih - San Jose CA, US
Tracy C. Denk - Aliso Viejo CA, US

Broadcom Corporation - Irvine CA

H04N 5/44, H04N 3/27

348554, 348725

A television on a chip (TVOC) system that provides a cost effective approach for providing television functionality on a single integrated circuit chip is disclosed. A TVOC includes the functionality necessary to receive and display television signals in a variety of input and output formats. A TVOC can be used in set-top boxes for cable and satellite television, or directly within a television. All functionality provided can be provided on a single integrated circuit. TVOC includes a data transport module, an IF demodulator, a digital audio engine, an analog audio engine, a digital video engine, and an analog video engine. The TVOC also includes three sets of interfaces including output interfaces, control interfaces and ancillary interfaces. Further features and embodiments provide enhanced functionality and increased efficiencies.