THOMAS SHEUNG WONG
Pilots at 33 Ave, Seattle, WA
License number
Washington A4972355
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
2126 33Rd Ave W, Seattle, WA 98199
Professional information
Warehouse Manager At B+C Telephone
Position:
WAREHOUSE MANAGER at B+C TELEPHONE
Location:
Greater Seattle Area
Industry:
Telecommunications
Work:
B+C TELEPHONE
-
WAREHOUSE MANAGER
Mis Assistant At Hilton
Position:
MIS Assistant at Hilton, MIS Assistant at Hilton Hotels
Location:
Greater Seattle Area
Industry:
Hospitality
Work:
Hilton
-
MIS Assistant
Hilton Hotels
since 2006
-
MIS Assistant
Skills:
Active Directory
Securing Heat Sinks
US Patent:
6522545, Feb 18, 2003
Filed:
Jun 19, 2002
Appl. No.:
10/174700
Inventors:
David Shia - Bellevue WA
Thomas J. Wong - Seattle WA
Thomas J. Wong - Seattle WA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 720
US Classification:
361704, 24458, 2989003, 248510, 257719
Abstract:
A heat sink retention frame is disposed about an electronic package, and a heat sink is disposed within the heat sink retention frame above the electronic package. A clip is mounted across a lateral edge surface of the heat sink and fastened to the heat sink retention frame. The clip can help hold the heat sink in place during normal operation and can retain the heat sink in the retention frame during mechanical shocks.
Heat Sink Assembly For An Integrated Circuit
US Patent:
6515862, Feb 4, 2003
Filed:
Mar 31, 2000
Appl. No.:
09/539825
Inventors:
Thomas J. Wong - Seattle WA
Ketan R. Shah - Tumwater WA
Joseph S. Alina - Poulsbo WA
Ketan R. Shah - Tumwater WA
Joseph S. Alina - Poulsbo WA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 720
US Classification:
361710, 361687, 361695, 361704, 257713, 165121, 454184
Abstract:
A heat sink for a microprocessor includes a thermally conductive base having a plurality of substantially parallel, arcuate fin structures extending outwardly in a vertical direction from the thermally conductive base. The plurality of substantially parallel fin structures have a high fin density to enhance heat dissipation from the heat sink. In one embodiment, a shroud encloses the fin structures and is attached to the thermally conductive base via latches that fit into a pair of grooves in the bottom surface of the thermally conductive base. A fan is attached to the shroud to direct a convection medium through the plurality of substantially parallel fin structures. Also described is a method of fabricating a heat sink assembly.
Heat Sink Retention Frame
US Patent:
6519153, Feb 11, 2003
Filed:
Aug 8, 2001
Appl. No.:
09/925714
Inventors:
David Shia - Redmond WA
Thomas J. Wong - Seattle WA
Thomas J. Wong - Seattle WA
Assignee:
Intel Corporation - Hillsboro OR
International Classification:
H05K 720
US Classification:
361704, 257719, 24458, 165 803, 165185, 361710, 361719, 361720
Abstract:
An assembly is disclosed including a printed circuit board, a single piece heat sink retention frame secured to the printed circuit board, the frame comprising four structural members surrounding an aperture, an integrated circuit chip secured to the printed circuit board and positioned within the aperture and a heat sink secured to the frame, the heat sink positioned above the integrated circuit chip and at least partially within the aperture.
Integrated Circuit Heat Sink Support And Retention Mechanism
US Patent:
6529378, Mar 4, 2003
Filed:
Jan 5, 2001
Appl. No.:
09/754973
Inventors:
Thomas Wong - Seattle WA
Neal Ulen - Lacey WA
Peter Davison - Puyallup WA
Ketan Shah - Tumwater WA
Neal Ulen - Lacey WA
Peter Davison - Puyallup WA
Ketan Shah - Tumwater WA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 720
US Classification:
361704, 24458, 248510, 257727, 439485
Abstract:
The present invention provides an improved heat sink retention assembly, such that the heat sink is physically supported by a base rather than by an integrated circuit. Traditional heat sinks have an alignment feature that physically aligns and supports the heat sink by contact of the feature with an integrated circuit, and that transfers force applied to the heat sink to the integrated circuit. This transferred force may be seen as shear stress at the pins of integrated circuits such as pin-grid arrays, and may damage the integrity of the integrated circuit or its connection to an external circuit. The present invention provides alignment and support features remote from contact with the integrated circuit, and therefore provides support for the heat sink in a manner that does not place substantial stress on the integrated circuit.
Processor Emi Shielding
US Patent:
6243265, Jun 5, 2001
Filed:
Oct 6, 1999
Appl. No.:
9/413417
Inventors:
Thomas Wong - Seattle WA
Neal Ulen - Lacey WA
Neal Ulen - Lacey WA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 720
US Classification:
361704
Abstract:
A heat sink retention module provides physical support for a heat sink while providing an electrical ground path for the heat sink. The retention module includes a ground strip that maintains an electrical contact with the heat sink while contacting a circuit board ground connection. In one embodiment, the ground strip includes upwardly extending spring members that contact the heat sink. In another embodiment, the ground strip includes a Faraday Cage formed from downwardly extending tabs. The retention module can be used in conjunction with an electrically conductive heat sink to provide a ground plane over an integrated circuit to shield the circuit from electromagnetic interference.
Heat Sink Retention Components And System
US Patent:
6205026, Mar 20, 2001
Filed:
Jan 31, 2000
Appl. No.:
9/494807
Inventors:
Thomas J. Wong - Seattle WA
Neal Ulen - Lacey WA
Ketan R. Shah - Tumwater WA
Neal Ulen - Lacey WA
Ketan R. Shah - Tumwater WA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 720
US Classification:
361704
Abstract:
An integrated circuit system has an increased reliability when subjected to stress and vibration. The system includes heat sink retention clips that provide support to the retention system when an upward force is applied to a heat sink. An EMI shield can be provided that provides peripheral shielding for the circuit package thermally coupled to the heat sink.
Research At University Of Washington
Position:
Research at University of Washington
Location:
Greater Seattle Area
Industry:
Research
Work:
University of Washington
-
Research
Heat Sink Clip For An Electronic Assembly
US Patent:
6101096, Aug 8, 2000
Filed:
Jun 10, 1999
Appl. No.:
9/330242
Inventors:
Mike MacGregor - Olympia WA
Michael T. Crocker - Tacomoa WA
Thomas Wong - Seattle WA
Peter Davison - Sumner WA
Rolf A. Konstad - Gold River CA
David A. Jones - El Dorado Hills CA
Michael T. Crocker - Tacomoa WA
Thomas Wong - Seattle WA
Peter Davison - Sumner WA
Rolf A. Konstad - Gold River CA
David A. Jones - El Dorado Hills CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 720
US Classification:
361720
Abstract:
A fastener for an electronic assembly. The fastener may have a spring arm that extends from a stem. The fastener can attach a cover to a heat sink of an electronic assembly. The stem may be inserted into a boss of the cover. The spring arm may exert a force onto the heat sink to press the sink into an integrated circuit package of the assembly.