Inventors:
Terry Tarn - Pittsford NY
Thomas G. Bailey - Rochester NY
Assignee:
Eastman Kodak Company - Rochester NY
International Classification:
H05K 1304
Abstract:
A package design and a method of assembling an array of CCD image devices on a substrate to provide an assembly with an optically flat surface. A tolerance of approximately between 2 and 3 microns is achieved by a process requiring less finishing of the substrates used by conventional processes. The assembly package can be used to bond an array of image sensors on a substrate having less than optimum flatness while still maintaining the optical surfaces of the image sensors within a single focal plane.