THOMAS JOSEPH MCKEONE
Pilots at Gaines Ct, Austin, TX
License number
Texas A4438336
Issued Date
May 2016
Expiration Date
May 2018
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
4004 Gaines Ct, Austin, TX 78735
Personal information
See more information about THOMAS JOSEPH MCKEONE at radaris.comName
Address
Phone
4004 Gaines Ct, Austin, TX 78735
4004 Gaines Ct, Austin, TX 78735
Professional information
Integrated Circuit Internal Heating System And Method Therefor
US Patent:
6815965, Nov 9, 2004
Filed:
Jun 2, 2000
Appl. No.:
09/585921
Inventors:
David Eppes - Austin TX
Thomas J. McKeone - Austin TX
Thomas J. McKeone - Austin TX
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
G01R 3126
US Classification:
324760, 3241581
Abstract:
Substrate removal for analysis of a semiconductor die is enhanced via a method and system for heating the die. According to an example embodiment of the present invention, a plurality of heating elements are formed in a semiconductor die. The die is operated while at least one of the plurality of heating elements heats a portion of the die adjacent the heating element. A response to the heating is detected and used to analyze the die. The present invention makes possible selective heating of the die in a manner that is readily controllable and implemented. Die analysis, including, for example, critical timing path analysis, is enhanced by this ability to controllably heat the die.
Integrated Circuit Heating System And Method Therefor
US Patent:
6879172, Apr 12, 2005
Filed:
Jun 2, 2000
Appl. No.:
09/586192
Inventors:
David Eppes - Austin TX, US
Thomas J. McKeone - Austin TX, US
Thomas J. McKeone - Austin TX, US
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
G01R031/26
US Classification:
324760, 3241581
Abstract:
Semiconductor die analysis is enhanced via a method and system that use a heater having a plurality of heating elements to heat a selected portion of the die. According to an example embodiment of the present invention, the heater is thermally coupled to the die, and the die is operated while at least one of the plurality of heating elements heats a portion of the die. A response is detected and used to analyze the die. The present invention makes possible selective heating of the die in a manner that is readily controllable and implemented. Die analysis, including, for example, critical timing path analysis, is enhanced by this ability to controllably heat the die.
Thomas Mckeone
Location:
Austin, Texas Area
Industry:
Semiconductors