Inventors:
Thomas J. Davis - Binghamton NY, US
Subahu D. Desai - Vestal NY, US
John M. Lauffer - Waverly NY, US
Voya R. Markovich - Endwell NY, US
Assignee:
Endicott Interconnect Technologies, Inc. - Endicott NY
International Classification:
H05K 3/10, H01R 12/04
US Classification:
29852, 29830, 29846, 174261
Abstract:
A method of making a multilayered circuitized substrate in which a continuous process is used to form electrically conductive layers which each will form part of a sub-composite. The sub-composites are then aligned such that openings within the conductive layers are also aligned, the sub-composites are then bonded together, and a plurality of holes are then laser drilled through the entire thickness of the bonded structure. The dielectric layers used in the sub-composites do not include continuous or semi-continuous fibers therein, thus expediting hole formation there-through.