Inventors:
Robert R. Kornowski - Schaumburg IL
Carl Missele - Elgin IL
Thomas W. Rice - Phoenix AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H05K 506
Abstract:
An electronic device package (10) is resistant to rupture at high temperatures. The electronic device package (10) includes a cap (14) having side-walls (18) coupled to a support structure (11) via an adhesive (15). The cap (14) is permeable to gases including water vapor. The side-walls (18) of the cap (14) are made of a porous ceramic material which absorbs a portion of the adhesive (15) via capillary action while curing the adhesive (15).