THOMAS C ROCHE
Engineering in Scottsdale, AZ

5650356, Jul 22, 1997

Mar 11, 1996

8/613327

Gordon M. Grivna - Mesa AZ
Gregory W. Grynkewich - Gilbert AZ
Thomas S. Roche - Scottsdale AZ

Motorola, Inc. - Schaumburg IL

H01L 2144

437194

A method is provided for reducing corrosion in openings on a semiconductor wafer. An etched opening is provided in a dielectric material on the semiconductor wafer. The etched opening and the dielectric material are cleaned with a basic solution. The exposed metal surface is treated with a hydrogen peroxide solution before exposing the exposed metal surface to an aqueous solution.

6190737, Feb 20, 2001

Feb 4, 1998

9/018703

Thomas Andrew Roche - Scottsdale AZ
Anthony Neil Davino - Scottsdale AZ
Vinton John Lewis - Birchwood MN

Motorola, Inc. - Schaumburg IL
Summit Coating Technologies - Elmhurst IL

B05D 302

427386

A method (10) for coating a substrate including at least an elastomer substrate portion with a conductive coating is described. The method includes steps of (i) providing a substrate comprising elastomer material and (ii) coating (13) the substrate with an adhesion promoting layer. The layer comprises a thin layer of B stage heat curable epoxy. The method also includes steps of (iii) pre-curing (15) the adhesion-promoting layer, (iv) disposing (17) a conductive coating atop the layer and (v) post-curing (19) the adhesion-promoting layer.

6924172, Aug 2, 2005

Aug 26, 2003

10/649426

Thomas S. Roche - Scottsdale AZ, US
Paule C. Aschieri - Tempe AZ, US

Freescale Semiconductor, Inc. - Austin TX

H01L021/44

438106, 438127, 438612, 438688

A top-most layer () is formed over a bond pad layer () and under a passivation layer () and a polyimide layer (). Openings (and ) are formed within the passivation layer () and the polyimide layer () to expose the top-most layer (), which protects the bond pad layer () during the formation of the openings (and ). In one embodiment, the exposed top-most layer () is selectively etched using hydrogen peroxide and an amine, such as ammonium hydroxide. Because the chemistry does not attack the bond pad layer (), the bond pad layer's thickness is not decreased and thus, reliability of the bond pad is maintained.

5453401, Sep 26, 1995

May 1, 1991

7/694155

Gordon M. Grivna - Mesa AZ
Gregory W. Grynkewich - Gilbert AZ
Thomas S. Roche - Scottsdale AZ

Motorola, Inc. - Schaumburg IL

H01L 2144

437194

A method is provided for reducing corrosion of metal surfaces that are comprised of at least aluminum and copper. An organic mask is exposed with a pattern. The organic mask is then subsequently developed, thereby producing open areas in the organic mask that expose portions of the metal surfaces. Applying a solution of hydrogen peroxide to the exposed metal surface, thereby creating a protective film prior to rinsing the exposed metal surface in an aqueous solution.

5966799, Oct 19, 1999

Apr 1, 1997

8/831118

Wade Norman Understiller - Mesa AZ
Thomas Andrew Roche - Scottsdale AZ
Ronald Dee Fuller - Mesa AZ

Motorola, Inc. - Schaumburg IL

H01P 1100

29600

A method (60) for molding (67) a component (73) including a free floating insert (11). The method includes steps of providing an insert (11) including one or more weakened regions (23) coupled to a removable leader (20) and molding (67) a moldable compound (25) about the insert (11) and a portion of the removable leader (20). The method (60) further includes a step of pulling (69) on the removable leader (20) to fracture the weakened regions (23) and thereby detach the removable leader (20) from a molded component (73) including the insert (11) therein. The molding step (67) desirably includes a step of injection molding (67) a thermoplastic material (25) about the insert (11) and the portion of the removable leader (20).