THOMAS A FITZGERALD
Broker in Framingham, MA

5077878, Jan 7, 1992

Jul 11, 1990

7/551219

Craig A. Armiento - Acton MA
Chirravuri Jagannath - Medfield MA
Marvin J. Tabasky - West Peabody MA
Thomas W. Fitzgerald - Framingham MA
Harry F. Lockwood - Waban MA
Paul O. Haugsjaa - Acton MA
Mark A. Rothman - Acton MA
Vincent J. Barry - Framingham MA
Margaret B. Stern - Sudbury MA

GTE Laboratories Incorporated - Waltham MA

H01L 2102, H01L 2120, H01L 21302

29 2502

A method of passively aligning optical receiving elements such as fibers to the active elements of a light generating chip includes the steps of forming two front and one side pedestal structures on the surface of a substrate body, defining a vertical sidewall of the chip to form a mating channel having an edge at a predetermined distance from the first active element, mounting the chip epi-side down on the substrate surface, and positioning the fibers in fiber-receiving channels to that a center line of each fiber is aligned to a center line of a respective active element. When mounted, the front face of the chip is abutting the contact surfaces of the two front pedestals, and the defined sidewall of the mating channel is abutting the contact surface of the side pedestal. The passive alignment procedure is also effective in aligning a single fiber to a single active element.

5163108, Nov 10, 1992

Aug 2, 1991

7/739587

Craig A. Armiento - Acton MA
Chirravuri Jagannath - Medfield MA
Marvin J. Tabasky - West Peabody MA
Thomas W. Fitzgerald - Framingham MA
Harry F. Lockwood - Waban MA
Paul O. Haugsjaa - Acton MA
Mark A. Rothman - Acton MA
Vincent J. Barry - Framingham MA
Margaret B. Stern - Sudbury MA

GTE Laboratories Incorporated - Waltham MA

G02B 642

385 89

A method of passively aligning optical receiving elements such as fibers to the active elements of a light generating chip includes the steps of forming two front and one side pedestal structures on the surface of a substrate body, defining a vertical sidewall of the chip to form a mating channel having an edge at a predetermined distance from the first active element, mounting the chip epi-side down on the substrate surface, and positioned the fibers in fiber-receiving channels so that a center line of each fiber is aligned to a center line of a respective active element. When mounted, the front face of the chip is abutting the contact surfaces of the two front pedestals, and the defined sidewall of the mating channel is abutting the contact surface of the side pedestal. The passive alignment procedure is also effective in aligning a single fiber to a single active element.

5182782, Jan 26, 1993

Jan 7, 1992

7/817570

Marvin Tabasky - Peabody MA
Victor Cataldo - Wilmington MA
Thomas W. Fitzgerald - Framingham MA
Jagannath Chirravuri - Medfield MA
Craig A. Armiento - Acton MA
Paul O. Haugsjaa - Acton MA

GTE Laboratories Incorporated - Waltham MA

G02B 642

385 89

A waferboard assembly incorporates mechanical registration features into a substrate platform to facilitate the passive alignment of lasers integrated on a chip to fibers in integral contact with the substrate. The waferboard includes two front pedestal structures and one side pedestal structure, and two vertical post structures within a mounting region defined by the pedestal structures. The laser chip is mounted on the vertical post structures, and placed in concurrent abutting contact with the pedestal structures. The waferboard is fabricated by etching the substrate to form the front and side pedestal structures, and etching the substrate to define the grooves. In order to form the post structures, a polyimide material is deposited on the substrate using an appropriate mask.

5436996, Jul 25, 1995

Sep 28, 1994

8/314572

Marvin Tabasky - Peabody MA
Victor Cataldo - Wilmington MA
Thomas W. Fitzgerald - Framingham MA
Jagannath Chirravuri - Medfield MA
Craig A. Armiento - Acton MA

GTE Laboratories Incorporated - Waltham MA

G02B 600, B44C 122

385 89

A waferboard assembly incorporates mechanical registration features into a substrate platform to facilitate the passive alignment of lasers integrated on a chip to fibers in integral contact with the substrate. The waferboard includes two front pedestal structures and one side pedestal structure, and two vertical post structures within a mounting region defined by the pedestal struutures. The laser chip is mounted on the vertical post structures, and placed in concurrent abutting contact with the pedestal structures. The waferboard is fabricated by etching the substrate to form the front and side pedestal structures, and etching the substrate to define the grooves. In order to form the post structures, a polyimide material is deposited on the substrate using an appropriate mask.

5268066, Dec 7, 1993

Dec 30, 1992

7/999513

Marvin Tabasky - Peabody MA
Victor Cataldo - Wilmington MA
Thomas W. Fitzgerald - Framingham MA
Jagannath Chirravuri - Medfield MA
Craig A. Armiento - Acton MA
Paul O. Haugsjaa - Acton MA

GTE Laboratories Incorporated - Waltham MA

H01L 21306, B44C 122, C03C 1500, C03C 2506

156633

A waferboard assembly incorporates mechanical registration features into a substrate platform to facilitate the passive alignment of lasers integrated on a chip to fibers in integral contact with the substrate. The waferboard includes two front pedestal structures and one side pedestal structure, and two vertical post structures within a mounting region defined by the pedestal structures. The laser chip is mounted on the vertical post structures, and placed in concurrent abutting contact with the pedestal structures. The waferboard is fabricated by etching the substrate to form the front and side pedestal structures, and etching the substrate to define the grooves. In order to form the post structures, a polyimide material is deposited on the substrate using an appropriate mask.