Inventors:
Kenneth C. Petersen - Brick NJ, US
Thomas Einhorn - Boston MA, US
David L. Reed - Syracuse NY, US
Assignee:
Warsaw Orthopedic, Inc. - Warsaw IN
International Classification:
A61F 2/28
US Classification:
623 2361, 623 2343, 623 2221
Abstract:
An osteoconductive backing implant for joint revisions is provided that may enhance bone healing and, for cementless implants, bony integration of the implant. The backing implant comprises a generally planar surface that may be formed into a generally hemispherical shape. In one embodiment, the backing implant comprises a disc having an inner hole and an outer edge, at least one slit extending from the inner hole to the outer edge. The disc may be formed from a coherent mass of elongate, mechanically entangled demineralized bone particles.