Steven Wade Peterson
Dentist in Tucson, AZ
License number
Utah 6291315-8903
Issued Date
Aug 25, 2006
Expiration Date
May 31, 2008
Category
Dental
Type
Dentist Controlled Substance (Schedule 2-5)
Address
Address
Tucson, AZ
Education
UNIVERSITY OF NEVADA LAS VEGAS (UNLV)
Professional information
Steven E. Peterson - Tucson, AZ
Work:
Dental Power
National Director, Dentist Placement Advantage Pain Treatment and Rehabilitation Centers of Baltimore - Baltimore, MD
Director, Department of Craniofacial Pain and Temporomandibular Joint Disorders Bethesda Temporomandibular Joint and Facial Pain Treatment Centers - Bethesda, MD
Associate Westwood Family Dental Centers - Baltimore, MD
Clinical Director/Practice Manager Baltimore Claimpersons Association - Baltimore, MD
Clinical Consultant Dental HMO - Marlow Heights, MD
Staff Dentist Georgetown University School of Dentistry
Instructor Stanton Calhoun, DDS - Springfield, VA
Associate Dentist
National Director, Dentist Placement Advantage Pain Treatment and Rehabilitation Centers of Baltimore - Baltimore, MD
Director, Department of Craniofacial Pain and Temporomandibular Joint Disorders Bethesda Temporomandibular Joint and Facial Pain Treatment Centers - Bethesda, MD
Associate Westwood Family Dental Centers - Baltimore, MD
Clinical Director/Practice Manager Baltimore Claimpersons Association - Baltimore, MD
Clinical Consultant Dental HMO - Marlow Heights, MD
Staff Dentist Georgetown University School of Dentistry
Instructor Stanton Calhoun, DDS - Springfield, VA
Associate Dentist
Education:
Georgetown University School of Dentistry
Doctor of Dental Surgery University of Arizona
Bachelor of Science in Zoology
Doctor of Dental Surgery University of Arizona
Bachelor of Science in Zoology
Steven P Peterson, Tucson AZ
Work:
Centra Realty 4th Avenue Tucson, AZ
Tucson
(520) 490-4862
Tucson
(520) 490-4862
Steven Peterson, Tucson AZ
Work:
Century 21
Tucson
(520) 882-0767
Tucson
(520) 882-0767
Steven W Peterson, Las Vegas NV
Specialties:
Dentist
Address:
1257 Paiute Cir, Las Vegas, NV 89106
7701 E Broadway Blvd, Tucson, AZ 85710
7701 E Broadway Blvd, Tucson, AZ 85710
Semiconductor Device Thermal Connection
US Patent:
7880298, Feb 1, 2011
Filed:
Dec 5, 2007
Appl. No.:
11/950819
Inventors:
Peter J. Drake - Benson AZ, US
Chad E. Boyack - Tucson AZ, US
Kevin Andrew Paulson - Salt Lake City UT, US
James E. Faoro - Tucson AZ, US
Cynthia Robin Nelson Konen - Anoka MN, US
Steven N. Peterson - Tucson AZ, US
George R. Cunnington - Oro Valley AZ, US
James R. Myers - Tucson AZ, US
Isis Roche-Rios - Tucson AZ, US
Chad E. Boyack - Tucson AZ, US
Kevin Andrew Paulson - Salt Lake City UT, US
James E. Faoro - Tucson AZ, US
Cynthia Robin Nelson Konen - Anoka MN, US
Steven N. Peterson - Tucson AZ, US
George R. Cunnington - Oro Valley AZ, US
James R. Myers - Tucson AZ, US
Isis Roche-Rios - Tucson AZ, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
H01L 23/10, H01L 23/34
US Classification:
257706, 257707
Abstract:
A semiconductor device thermal connection used to remove heat from a semiconductor device, such as an integrated circuit, includes a metallic barrier layer on the semiconductor device, and a high thermal conductivity material on the metallic barrier layer that joins the semiconductor device to a thermal heat spreader. The metallic barrier layer may be one or more sputtered layers, and the high thermal conductivity material may be a metallic material, for instance including indium, that is soldered onto the sputtered material. The high thermal conductivity material may form a primary thermal connection in conducting heat away from the semiconductor device. A secondary thermal connection may be made between the heat spreader and a heat sink. The secondary thermal connection may include a compressible solid carbon fiber material. A diaphragm may be used to contain the carbon fiber material, to prevent carbon fibers from coming into contact with the semiconductor device.
Methods And Apparatus For Heat Transfer For A Component
US Patent:
2009025, Oct 15, 2009
Filed:
Jan 30, 2009
Appl. No.:
12/363240
Inventors:
James E. Faoro - Tucso AZ, US
James R. Myers - Tucson AZ, US
Isis Roche-Rios - Tucson AZ, US
Steven N. Peterson - Tucson AZ, US
Cynthia R. Konen - Anoka MN, US
George R. Cunnington - Oro Valley AZ, US
Kevin A. Paulson - Salt Lake City UT, US
James R. Myers - Tucson AZ, US
Isis Roche-Rios - Tucson AZ, US
Steven N. Peterson - Tucson AZ, US
Cynthia R. Konen - Anoka MN, US
George R. Cunnington - Oro Valley AZ, US
Kevin A. Paulson - Salt Lake City UT, US
International Classification:
H05K 7/20
US Classification:
361719
Abstract:
Methods and apparatus for transferring heat according to various aspects of the present invention operate in conjunction with a heat source on a substrate. In one embodiment, a lid is adapted to engage the substrate. The lid may comprise a thermally conductive rigid body and one or more hardstops configured to limit a bond line distance between the rigid body and the heat source. A thermal interface material may be disposed in the bond line between the heat source and the lid. The thermal interface material may be adapted to provide a thermally conductive adhesive bond between the lid and the heat source.