DR. STEVEN W. PETERSON, D.M.D.
Dentist at Paiute Cir, Las Vegas, NV
License number
Nevada 6231
Category
Dentist
Type
General Practice
License number
Nevada 7110
Category
Dentist
Type
General Practice
Address
Address
2
1257 Paiute Cir, Las Vegas, NV 89106
10526 E Avalon Park St, Tucson, AZ 85747
10526 E Avalon Park St, Tucson, AZ 85747
Phone
(702) 382-0784
(702) 384-5272 (Fax)
(702) 273-6837
(702) 384-5272 (Fax)
(702) 273-6837
Personal information
See more information about STEVEN W. PETERSON at radaris.comName
Address
Phone
4648 N 19Th Ave, Phoenix, AZ 85015
4428 Vincente Ln, Las Vegas, NV 89130
4530 W Mclellan Rd APT 64, Glendale, AZ 85301
2949 Oakmont Dr, Flagstaff, AZ 86004
7701 Osborn Rd, Scottsdale, AZ 85251
Professional information
See more information about STEVEN W. PETERSON at trustoria.com
Steven E. Peterson - Tucson, AZ
Steven E. Peterson - Tucson, AZ
Work:
Dental Power
National Director, Dentist Placement Advantage Pain Treatment and Rehabilitation Centers of Baltimore - Baltimore, MD
Director, Department of Craniofacial Pain and Temporomandibular Joint Disorders Bethesda Temporomandibular Joint and Facial Pain Treatment Centers - Bethesda, MD
Associate Westwood Family Dental Centers - Baltimore, MD
Clinical Director/Practice Manager Baltimore Claimpersons Association - Baltimore, MD
Clinical Consultant Dental HMO - Marlow Heights, MD
Staff Dentist Georgetown University School of Dentistry
Instructor Stanton Calhoun, DDS - Springfield, VA
Associate Dentist
National Director, Dentist Placement Advantage Pain Treatment and Rehabilitation Centers of Baltimore - Baltimore, MD
Director, Department of Craniofacial Pain and Temporomandibular Joint Disorders Bethesda Temporomandibular Joint and Facial Pain Treatment Centers - Bethesda, MD
Associate Westwood Family Dental Centers - Baltimore, MD
Clinical Director/Practice Manager Baltimore Claimpersons Association - Baltimore, MD
Clinical Consultant Dental HMO - Marlow Heights, MD
Staff Dentist Georgetown University School of Dentistry
Instructor Stanton Calhoun, DDS - Springfield, VA
Associate Dentist
Education:
Georgetown University School of Dentistry
Doctor of Dental Surgery University of Arizona
Bachelor of Science in Zoology
Doctor of Dental Surgery University of Arizona
Bachelor of Science in Zoology
Steven Peterson - Las Vegas, NV
Steven Peterson - Las Vegas, NV
Work:
Robert Half Technology
Fedex Express - Las Vegas, NV
Courier Computer Paramedics - Las Vegas, NV
Computer Technician United States Postal Service - Las Vegas, NV
Courier Computer Paramedics - Las Vegas, NV
Computer Technician United States Postal Service - Las Vegas, NV
Education:
Rockledge High School - Rockledge, FL
Diploma Asher College - Las Vegas, NV
Diploma Asher College - Las Vegas, NV
Dr. Steven W Peterson, Las Vegas NV - DDS (Doctor of Dental Surgery)
Dr. Steven W Peterson, Las Vegas NV - DDS (Doctor of Dental Surgery)
Specialties:
Dentistry
Address:
1257 Paiute Cir, Las Vegas 89106
(702) 382-0784 (Phone), (702) 384-5272 (Fax)
(702) 382-0784 (Phone), (702) 384-5272 (Fax)
Languages:
English
Steven W Peterson, Las Vegas NV
Steven W Peterson, Las Vegas NV
Specialties:
Dentist
Address:
1257 Paiute Cir, Las Vegas, NV 89106
7701 E Broadway Blvd, Tucson, AZ 85710
7701 E Broadway Blvd, Tucson, AZ 85710
Steven Peterson, Tucson AZ - Agent
Steven Peterson, Tucson AZ - Agent
Work:
Century 21
Tucson
(520) 882-0767
Tucson
(520) 882-0767
Steven P Peterson, Tucson AZ - Agent
Steven P Peterson, Tucson AZ - Agent
Work:
Centra Realty 4th Avenue Tucson, AZ
Tucson
(520) 490-4862
Tucson
(520) 490-4862
Semiconductor Device Thermal Connection
Semiconductor Device Thermal Connection
US Patent:
7880298, Feb 1, 2011
Filed:
Dec 5, 2007
Appl. No.:
11/950819
Inventors:
Peter J. Drake - Benson AZ, US
Chad E. Boyack - Tucson AZ, US
Kevin Andrew Paulson - Salt Lake City UT, US
James E. Faoro - Tucson AZ, US
Cynthia Robin Nelson Konen - Anoka MN, US
Steven N. Peterson - Tucson AZ, US
George R. Cunnington - Oro Valley AZ, US
James R. Myers - Tucson AZ, US
Isis Roche-Rios - Tucson AZ, US
Chad E. Boyack - Tucson AZ, US
Kevin Andrew Paulson - Salt Lake City UT, US
James E. Faoro - Tucson AZ, US
Cynthia Robin Nelson Konen - Anoka MN, US
Steven N. Peterson - Tucson AZ, US
George R. Cunnington - Oro Valley AZ, US
James R. Myers - Tucson AZ, US
Isis Roche-Rios - Tucson AZ, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
H01L 23/10, H01L 23/34
US Classification:
257706, 257707
Abstract:
A semiconductor device thermal connection used to remove heat from a semiconductor device, such as an integrated circuit, includes a metallic barrier layer on the semiconductor device, and a high thermal conductivity material on the metallic barrier layer that joins the semiconductor device to a thermal heat spreader. The metallic barrier layer may be one or more sputtered layers, and the high thermal conductivity material may be a metallic material, for instance including indium, that is soldered onto the sputtered material. The high thermal conductivity material may form a primary thermal connection in conducting heat away from the semiconductor device. A secondary thermal connection may be made between the heat spreader and a heat sink. The secondary thermal connection may include a compressible solid carbon fiber material. A diaphragm may be used to contain the carbon fiber material, to prevent carbon fibers from coming into contact with the semiconductor device.
Methods And Apparatus For Heat Transfer For A Component
Methods And Apparatus For Heat Transfer For A Component
US Patent:
2009025, Oct 15, 2009
Filed:
Jan 30, 2009
Appl. No.:
12/363240
Inventors:
James E. Faoro - Tucso AZ, US
James R. Myers - Tucson AZ, US
Isis Roche-Rios - Tucson AZ, US
Steven N. Peterson - Tucson AZ, US
Cynthia R. Konen - Anoka MN, US
George R. Cunnington - Oro Valley AZ, US
Kevin A. Paulson - Salt Lake City UT, US
James R. Myers - Tucson AZ, US
Isis Roche-Rios - Tucson AZ, US
Steven N. Peterson - Tucson AZ, US
Cynthia R. Konen - Anoka MN, US
George R. Cunnington - Oro Valley AZ, US
Kevin A. Paulson - Salt Lake City UT, US
International Classification:
H05K 7/20
US Classification:
361719
Abstract:
Methods and apparatus for transferring heat according to various aspects of the present invention operate in conjunction with a heat source on a substrate. In one embodiment, a lid is adapted to engage the substrate. The lid may comprise a thermally conductive rigid body and one or more hardstops configured to limit a bond line distance between the rigid body and the heat source. A thermal interface material may be disposed in the bond line between the heat source and the lid. The thermal interface material may be adapted to provide a thermally conductive adhesive bond between the lid and the heat source.