STEVEN ERIC STEWART, CRNA
Nursing at Fountain View Dr, Houston, TX

6395845, May 28, 2002

Dec 15, 1998

09/212083

Daniel James Weinmann - Houston TX
Steven Lee Stewart - Houston TX

Resolution Performance Products LLC

C08K 310

525523, 523450, 523457, 523466, 525113, 525454, 525502, 525504, 528113

The present invention relates to thermoset epoxy resin waterproofing membranes for structures such as roofs comprising: (a) one or more epoxy resin(s) having an average of at least 1. 5 epoxy groups per molecule; (b) a liquid amine terminated polyamide prepared by reacting at least one C dicarboxylic acid and an aminoalkylpiperazine in a ratio of moles of aminoalkylpiperazine to equivalents of carboxyl group in the acid of greater than 0. 75:1; (c) one or more optional polyamine(s); (d) one or more optional filler(s); and (e) one or more optional modifying resin(s) wherein the tensile modulus of the thermoset epoxy waterproofing membranes is less than 200,000 psi and the tensile elongation of the thermoset epoxy waterproofing membranes is greater than 20%.

6136944, Oct 24, 2000

Nov 29, 1999

9/449870

Steven Lee Stewart - Houston TX
Derek Scott Kincaid - Houston TX

Shell Oil Company - Houston TX

C08G 5960, C08K 0326, C08K 0336, C08L 6302, C08L 7708

528120

The present invention relates to a flexible industrial adhesive composition which effectively bonds thermoplastic polymer substrates and substrates having low stiffness such as fabric, rubbers and asphaltic materials, to materials selected from metals, fabrics, rubbers, engineered materials, and concrete, said flexible industrial adhesive composition comprising: (a) one or more epoxy resin(s) having an average of at least 1. 5 epoxy groups per molecule; (b) a liquid amine terminated polyamide prepared by reacting at least one C. sub. 18-50 dicarboxylic acid and an aminoalkylpiperazine in a ratio of moles of aminoalkylpiperazine to equivalents of carboxyl group in the acid of greater than 0. 75:1; (c) one or more optional polyamine(s); and (d) one or more optional filler(s); wherein the tensile modulus of the flexible industrial adhesive composition is less than 500,000 psi and the tensile elongation of the flexible industrial adhesive composition is greater than 10%. The flexible industrial adhesive compositions of the present invention can be used in industrial assembly and automotive/aerospace/transportation (buses, railroads).

2003017, Sep 11, 2003

Mar 5, 2002

10/091262

Steven Stewart - Houston TX, US
Carlton Ash - Sugar Land TX, US

B32B003/00, B32B005/16, B32B007/00, B32B007/12, B32B015/04

428/343000, 428/35500R, 428/347000

A solid or semi-solid thermoplastic adhesive adhered to a surface mount electronic device; an assembly made of at least a printed circuit board, a surface mount electronic device, solder joints providing a connection between the printed circuit board and the device, and solid thermoplastic adhesive joints attached to the device and the board. The thermoplastic adhesive is at least softened and applied to any available surface on the connecting substrate of the surface mounted electronic device. The thermoplastic adhesive is heated to a temperature sufficient to provide an adhesive joint between the organic surface and the board. There is also provided a thermoplastic adhesive composition having at least the following components: (A) from 5% to 98% by weight of a functionalized polyolefin, and (B) from 2% to 95% by weight of a polyamide compound.

6906425, Jun 14, 2005

Mar 5, 2002

10/091086

Steven L. Stewart - Houston TX, US
Carlton E. Ash - Sugar Land TX, US

Resolution Performance Products LLC - Houston TX

H01L023/48, H01L023/52, H01L029/40

257778, 257779, 257780, 257783, 257784, 257785, 257786

An assembly having a surface mounted electronic device mounted onto a printed circuit board and a thermoplastic adhesive applied to the surface mounted electronic device facing the printed circuit board and providing for a gap between the thermoplastic adhesive and the printed circuit board. The assembly is heated at solder reflow temperatures to at least soften the thermoplastic adhesive sufficiently to flow across the gap and provide a thermoplastic adhesive joint between the surface mounted electronic device and the printed circuit board.

5112206, May 12, 1992

May 16, 1991

7/700824

Steven L. Stewart - Houston TX

Shell Oil Company - Houston TX

B29C 4704

425114

Two co-reactive resin stream are mixed immediately adjacent the entrance of an impregnation die used to make products by the pultrusion process. The mixing occurs immediately adjacent the fibers as they are pulled into the central duct opening of the die. The resin streams are delivered to the entrance of the impregnation die by use of a resin feed head positioned at the inlet of the impregnation die. An ultrasonic driver coupled to the resin feed head vibrates and agitates the resin streams impinging the fibers so as to thoroughly wet the fiber bundle prior to its passage through the die.