STEVEN CHOR-YAN MAK
Pharmacy in Philadelphia, PA
License number
Pennsylvania PI086371L
Category
Pharmacy
Type
Pharmacy Intern
Address
Address
Philadelphia, PA 19145
Personal information
See more information about STEVEN CHOR-YAN MAK at radaris.comName
Address
Phone
152 Sequoia Dr, Newtown, PA 18940
1963 Bellevue Rd, Harrisburg, PA 17104
819 Morgan Ave, Drexel Hill, PA 19026
9859 Hoff St, Philadelphia, PA 19115
Newtown, PA
Professional information
It Programmer At Fmc
Location:
Greater Philadelphia Area
Industry:
Information Technology and Services
Process Engineer At Natel Engineering Co., Inc.
Location:
Greater Philadelphia Area
Industry:
Semiconductors
Process Engineer
Location:
Greater Philadelphia Area
Industry:
Electrical/Electronic Manufacturing
Reduced Oxidation System For Wire Bonding
US Patent:
2010023, Sep 16, 2010
Filed:
May 27, 2010
Appl. No.:
12/788827
Inventors:
Gary S. Gillotti - Lansdale PA, US
Steven Mak - Philadelphia PA, US
E. Walter Frasch - Perkasie PA, US
Steven Mak - Philadelphia PA, US
E. Walter Frasch - Perkasie PA, US
Assignee:
Kulicke and Soffa Industries, Inc. - Fort Washington PA
International Classification:
B23K 31/02, B23K 37/00, B23K 37/06
US Classification:
2281805, 228219, 228 41
Abstract:
A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area.
Reduced Oxidation System For Wire Bonding
US Patent:
2007025, Nov 1, 2007
Filed:
Apr 26, 2006
Appl. No.:
11/380233
Inventors:
Gary Gillotti - Bensalem PA, US
Steven Mak - Philadelphia PA, US
E. Frasch - Perkasie PA, US
Steven Mak - Philadelphia PA, US
E. Frasch - Perkasie PA, US
International Classification:
B23K 37/00, B23K 35/38
US Classification:
228004500, 228219000, 228180500
Abstract:
A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area.