STEPHEN S MARTIN, MD
Marriage and Family Therapists at Main St, Yarmouth, ME

8421168, Apr 16, 2013

Nov 16, 2010

12/947543

Howard Allen - Limington ME, US
Luke England - Boise ID, US
Douglas Alan Hawks - Escondido CA, US
Yong Liu - Scarborough ME, US
Stephen Martin - South Portland ME, US

Fairchild Semiconductor Corporation - San Jose CA

H01L 29/84

257416, 257415, 257419, 257686, 257E21613, 257E29324

This document discusses, among other things, a conductive frame, a silicon die coupled to the conductive frame, the silicon die including a vibratory diaphragm, the die having a silicon die top opposite a silicon die bottom, with a silicon die port extending through the silicon die to the vibratory diaphragm, with a silicon die terminal in electrical communication with the conductive frame and an insulator affixed to the conductive frame and the silicon die, with the insulator extending through interstices in the conductive frame to a conductive frame bottom of the conductive frame, and around an exterior of the silicon die to the silicon die top, with the insulator physically affixed to the silicon die and to the conductive frame, with the silicon die port exposed and with a conductive frame terminal disposed at the conductive frame bottom in electrical communication with the silicon die terminal.

2004008, Apr 29, 2004

Sep 17, 2003

10/664982

David Chong Lim - Penang, MY
Hun Lee - Penang, MY
Howard Allen - Limington ME, US
Stephen Martin - South Portland ME, US

H01L023/49

257/784000, 257/780000, 438/617000

A die attach package for connecting a die or chip of die-down orientation to a printed circuit board in a die-up orientation. The package includes a substrate with leads that may be traces terminating in vias or that may be the leads of a lead frame. The traces or the leads of the lead frame are modified such that they pass under the die when the die is attached. A flattened ball is attached to die contacts and a gold wire runs parallel to the die and then to a via on the substrate. The wire may be attached to the flattened ball by a wedge technique or other such known techniques. The die is attached to the substrate using a non-electrically-conductive material. This packaging enables a fabricator to make die of one orientation type, die down, and use that die in a die-up package, thereby saving on fabrication costs.

6891257, May 10, 2005

Mar 30, 2001

09/823600

David Chong - Penang, MY
Hun Kwang Lee - Penang, MY
Howard Allen - Limington ME, US
Stephen Martin - South Portland ME, US

Fairchild Semiconductor Corporation - South Portland ME

H01L023/02

257678, 257693, 257697

A die attach package for connecting a die or chip of die-down orientation to a printed circuit board in a die-up orientation. The package includes a substrate with leads that may be traces terminating in vias or that may be the leads of a lead frame. The traces or the leads of the lead frame are modified such that they pass under the die when the die is attached. The traces or leads are routed under the die such that proper connections are established from the topside of the die to the appropriate mount locations of the printed circuit board. The die is attached to the substrate using a non-electrically-conductive material. This packaging enables a fabricator to make die of one orientation type, die down, and use that die in a die-up package, thereby saving on fabrication costs.

2005024, Nov 3, 2005

Apr 29, 2004

10/835212

Jeff Kingsbury - Arundel ME, US
Stephen Martin - South Portland ME, US

H01L021/44

438617000

An integrated circuit chip with its interconnecting pads re-arranged in substantially a straight line. The pads are ordered in the straight line so that wire bond connections to contact terminal of an IC package allows the wire bonds to not interfere with each other by traveling under or over other wire bonds. This re-arrangement and ordering of an IC's pads allows a single die constructed in accordance with this invention to be mounted in both a package that is designed to accept a die-down type chip and a package designed to accept a die-up type chip. This mounting of the single chip occurs directly without any other transition artifacts, like transition substrates, etc., that would carry the reversal of the effective pad locations.

2005027, Dec 15, 2005

Jun 9, 2004

10/864909

Rajeev Joshi - Cupertino CA, US
Maria Estacio - Cebu City, PH
David Chong - Penang, MY
B. H. Gooi - Gelugor, MY
Stephen Martin - South Portland ME, US

H01L023/34, H01L021/48

257727000, 257690000, 257784000, 438117000

An integrated circuit assembly includes a lead frame having a plurality of leads with inner portions. A thermally-conductive clip member is bonded to the inner portions of the leads such that the clip member is electrically isolated from and yet thermally coupled to the lead frame. An integrated circuit die is bonded and thereby thermally coupled to the clip member. The die is electrically connected to the wire die by wire bonds. Encapsulant material is disposed over the inner portions of the leads and at least a portion of the clip member, and encapsulates the die and the wire bonds.

8211747, Jul 3, 2012

Dec 13, 2011

13/323979

Dan Kinzer - El Segundo CA, US
Yong Liu - Scarborough ME, US
Stephen Martin - South Portland ME, US

Fairchild Semiconductor Corporation - San Jose CA

H01L 21/00

438108, 257401, 257500, 257724, 257774, 257E23169, 257E2706

This document discusses, among other things, apparatus and methods for an IC package including first and a second discrete components fabricated into a semiconductor substrate. The first and second discrete components can be adjacent to one another in the semiconductor substrate, and an integrated circuit die can be mounted on the semiconductor substrate and coupled to the first and second discrete components.

8115260, Feb 14, 2012

Jan 6, 2010

12/683058

Dan Kinzer - San Jose CA, US
Yong Liu - Scarborough ME, US
Stephen Martin - South Portland ME, US

Fairchild Semiconductor Corporation - San Jose CA

H01L 27/088

257401, 257500, 257724, 257774, 257E23169, 257E2706

This document discusses, among other things, an IC package including first and a second discrete components fabricated into a semiconductor substrate. The first and second discrete components can be adjacent to one another in the semiconductor substrate, and an integrated circuit die can be mounted on the semiconductor substrate and coupled to the first and second discrete components.