STEPHEN M FISHER
Engineers in San Jose, CA
License number
Pennsylvania PE041129R
Category
Engineers
Type
Professional Engineer
Address
Address
2
San Jose, CA 95131
Pennsylvania
Pennsylvania
Professional information
Planarization System With Multiple Polishing Pads
US Patent:
6626744, Sep 30, 2003
Filed:
Apr 21, 2000
Appl. No.:
09/556495
Inventors:
John M. White - Hayward CA
Phillip R. Sommer - Newark CA
Stephen Fisher - San Jose CA
Phillip R. Sommer - Newark CA
Stephen Fisher - San Jose CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
B24B 100
US Classification:
451 66, 451168, 451173, 451307, 451461
Abstract:
An apparatus for simultaneously polishing wafers including at least a first and a second web of polishing media. At least two polishing heads are provided on a carrier coupled to a drive system such that one polishing head positions a wafer against the first web and a second polishing head positions a second wafer against the second web. The drive system imparts a programmed polishing motion or pattern to the polishing heads.
Method And Apparatus For Assembly Of Cmp Polishing Pads
US Patent:
2009031, Dec 24, 2009
Filed:
Jun 18, 2008
Appl. No.:
12/141907
Inventors:
Stephen Fisher - San Jose CA, US
Lynn Fisher - San Jose CA, US
Lynn Fisher - San Jose CA, US
International Classification:
B24D 11/00, B23P 19/00
US Classification:
51295, 29700
Abstract:
Polishing pads made up of individual polishing elements that protrude through holes in a guide plate are assembled by cascading a number of such polishing elements through a stack of assembly boxes in each of which are located the guide plates such that the polishing elements pass from an uppermost assembly box in the stack to a lowermost assembly box in the stack and in each respective assembly box of the stack are distributed over a respective guide plate therein. Accordingly, at least some of the polishing elements are captured within holes of the respective guide plates in the respective assembly boxes. The cascading may be initiated by displacement of the stack of assembly boxes about a pivot and the distribution of the polishing elements within the assembly boxes may be initiated by lateral displacement of the assembly boxes in the stack.
Polishing Pad With Endpoint Window And Systems And Methods Using The Same
US Patent:
2011014, Jun 16, 2011
Filed:
May 15, 2009
Appl. No.:
12/991097
Inventors:
Rajeev Bajaj - Fremont CA, US
Stephen Mark Fisher - San Jose CA, US
William D. Joseph - Maplewood MN, US
Stephen Mark Fisher - San Jose CA, US
William D. Joseph - Maplewood MN, US
International Classification:
H01L 21/306, B24B 41/00
US Classification:
438692, 451442, 257E2123
Abstract:
A polishing pad including a path therethrough to transmit a signal for in situ monitoring of an endpoint in a polishing operation. In one embodiment, the polishing pad includes a polishing composition distribution layer on a first side of a guide plate and a support layer on an opposed second side of a guide plate. The guide plate retains a plurality of polishing elements that extend along a first direction substantially normal to a plane including the polishing pad and through the polishing composition distribution layer. The polishing pad includes an optical path along the first direction and through a thickness of the pad.