STEPHEN J PEREIRA
Engineering in Hopedale, MA

7859835, Dec 28, 2010

Jun 10, 2009

12/482061

Angelo M. Puzella - Marlborough MA, US
Joseph A. Licciardello - Hudson NH, US
Stephen J. Pereira - Hopedale MA, US
Joseph R. Ellsworth - Worcester MA, US

Allegro Microsystems, Inc. - Worcester MA

H05K 7/20, H01Q 1/22, F28D 21/00

36167949, 36167947, 3616795, 361696, 361697, 165121, 165122, 16510433, 165185, 343700 MS, 343702, 343720, 343853

A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).

2009018, Jul 23, 2009

Jan 17, 2008

12/015918

Joseph R. Ellsworth - Worcester MA, US
Michael P. Martinez - Worcester MA, US
Stephen J. Pereira - Hopedale MA, US

H05K 7/20, H05K 3/00

361720, 361712, 29829, 361709

A printed circuit board (PCB) assembly is provided. The PCB assembly is adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device. The PCB assembly has a top surface and a bottom surface and comprises a signal carrying layer and an insert of pyrolytic graphite (PG). The signal carrying layer, disposed between the top surface and the bottom surface, comprises a material that is both thermally conductive and electrically conductive (such as at least one of aluminum, copper, and silver and alloys thereof) and has at least a portion lying in a first plane. The insert of PG is disposed within at least a portion of the first plane of the signal carrying layer, is in thermal contact with the signal carrying layer, and is constructed and arranged to have its greatest electrical conductivity in the first plane. Optionally, a conductive via can be formed in portions of the signal carrying layer not occupied by the insert of PG, where the conductive via operably couples a first side of the signal carrying layer to a second side of the signal carrying layer.

7888171, Feb 15, 2011

Dec 22, 2008

12/341191

Ralph Korenstein - Framingham MA, US
Steven D. Bernstein - Brighton MA, US
Stephen J. Pereira - Hopedale MA, US

Raytheon Company - Waltham MA

H01L 21/00, H01L 31/0312

438105, 438590, 257 77, 257615, 257E23111, 257E21096, 257E21105, 257E21107, 257E33025

In one aspect, a method includes fabricating a gallium nitride (GaN) layer with a first diamond layer having a first thermal conductivity and a second diamond layer having a second thermal conductivity greater than the first thermal conductivity. The fabricating includes using a microwave plasma chemical vapor deposition (CVD) process to deposit the second diamond layer onto the first diamond layer.

7884373, Feb 8, 2011

Apr 2, 2010

12/753354

Ralph Korenstein - Framingham MA, US
Steven D. Bernstein - Brighton MA, US
Stephen J. Pereira - Hopedale MA, US

Raytheon Company - Waltham MA

H01L 29/15, H01L 21/00

257 77, 257615, 257E23111, 257E21096, 257E21105, 257E21107, 438105, 438590

In one aspect, a method includes fabricating a gallium nitride (GaN) layer with a first diamond layer having a first thermal conductivity and a second diamond layer having a second thermal conductivity greater than the first thermal conductivity. The fabricating includes using a microwave plasma chemical vapor deposition (CVD) process to deposit the second diamond layer onto the first diamond layer.

8174024, May 8, 2012

Jun 10, 2011

13/157653

Ralph Korenstein - Framingham MA, US
Steven D. Bernstein - Brighton MA, US
Stephen J. Pereira - Hopedale MA, US

Raytheon Company - Waltham MA

H01L 31/0312

257 77, 257 40, 257 78, 257192, 257613

In one aspect, a device includes a gallium nitride (GaN) layer, a first diamond layer disposed on the GaN layer, a gate structure disposed in contact with the GaN layer and the first diamond layer, and a second diamond layer having a first thermal conductivity and disposed on a second surface of the GaN layer. The gate and the first diamond layer are disposed on a first surface of the GaN layer opposite the second surface of the GaN layer.

7989261, Aug 2, 2011

Dec 22, 2008

12/341115

Ralph Korenstein - Framingham MA, US
Steven D. Bernstein - Brighton MA, US
Stephen J. Pereira - Hopedale MA, US

Raytheon Company - Waltham MA

H01L 21/00

438105, 438 48, 438590, 438E21248, 257 77, 257 78

In one aspect, a method includes fabricating a device. The device includes a gallium nitride (GaN) layer, a diamond layer disposed on the GaN layer and a gate structure disposed in contact with the GaN layer and the diamond layer. In another aspect, a device includes a gallium nitride (GaN) layer, a diamond layer disposed on the GaN layer and a gate structure disposed in contact with the GaN layer and the diamond layer.

7898365, Mar 1, 2011

Sep 6, 2006

11/516873

Mark A. Koehnke - Attleboro MA, US
Stephen J. Pereira - Hopedale MA, US

Raytheon Company - Waltham MA

H03H 9/64

333193, 333196

An integrated SAW device features an electronic assembly, a SAW device mounted to the electronic assembly, and a heater element on the SAW device to minimize thermal resistance between the SAW device and the heater element.

8451165, May 28, 2013

Dec 6, 2010

12/960785

Angelo M. Puzella - Marlborough MA, US
Steven T. Cummings - Amherst NH, US
Joseph A. Licciardello - The Villages FL, US
Jerome H. Pozgay - Marblehead MA, US
Stephen J. Pereira - Hopedale MA, US
Michael G. Sarcione - Millbury MA, US
Peter D. Morico - North Grafton MA, US

Raytheon Company - Waltham MA

G01S 7/42, G01S 13/00, H01Q 1/32

342 70, 342 13, 342175, 343711, 343713

Described is a mobile radar system which provides both persistent surveillance and tracking of objects with adaptive measurement rates for both maneuvering and non-maneuvering objects. The mobile radar system includes a vehicle having mounted therein an active, electronically-steerable, phased array radar system movable between a stowed position and a deployed position and wherein the phased array radar system is operational in both the deployed and stored positions and also while the vehicle is either stationary or moving. Thus, the mobile radar system described herein provides for longer time on target and longer integration times, increased radar sensitivity and improved Doppler resolution and clutter rejection. This results in a highly mobile radar system appropriate for use in a battlefield environment and which supports single-integrated-air-picture metrics including but not limited to track purity, track completeness, and track continuity and thus improved radar performance in a battlefield.