STEPHEN ALAN CAMPBELL
Pilots at Sandeen Rd, Saint Paul, MN

License number
Minnesota A2673325
Issued Date
Jun 2016
Expiration Date
Jun 2018
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
3248 Sandeen Rd, Saint Paul, MN 55112

Professional information

Stephen Campbell Photo 1

Process For Forming Hafnium Oxide Films

US Patent:
6683011, Jan 27, 2004
Filed:
Nov 14, 2001
Appl. No.:
09/992173
Inventors:
Ryan C. Smith - Roseville MN
Tiezhong Ma - San Jose CA
Stephen A. Campbell - Shoreview MN
Wayne L. Gladfelter - Roseville MN
Assignee:
Regents of the University of Minnesota - Minneapolis MN
International Classification:
H01L 21469
US Classification:
438785, 438591, 257E21639
Abstract:
A process for forming a hafnium oxide-containing film on a substrate such as silicon that includes introducing an anhydrous hafnium nitrate-containing precursor into a reactor containing the substrate, and converting the precursor into the hafnium oxide-containing film on the substrate by chemical vapor deposition.


Stephen Campbell Photo 2

Optical Heating Device For Rapid Thermal Processing (Rtp) System

US Patent:
6122440, Sep 19, 2000
Filed:
Jan 27, 1999
Appl. No.:
9/238353
Inventors:
Stephen A. Campbell - Shoreview MN
Assignee:
Regents of The University of Minnesota - Minneapolis MN
International Classification:
F21V 700
US Classification:
392420
Abstract:
An optical heating device for use in a rapid thermal processing (RTP) system includes a substrate having first and second sides. A plurality of lamps are arranged in generally coaxially circles on the first side of the substrate. An optical reflector portion is formed in the substrate adjacent the lamps and is configured and positioned to reflect light from the lamps toward an object to be heated. The reflector is formed as a trough in the substrate.


Stephen Campbell Photo 3

Interconnect For Layered Integrated Circuit Assembly

US Patent:
4845542, Jul 4, 1989
Filed:
Jan 17, 1989
Appl. No.:
7/298806
Inventors:
Steve J. Bezuk - Inver Grove Heights MN
Tushar R. Gheewala - Eagan MN
Stephen A. Campbell - Woodbury MN
Robert J. Baseman - Pleasantville NY
Assignee:
Unisys Corporation - Blue Bell PA
International Classification:
H01L 2348
US Classification:
357 68
Abstract:
Enhanced density of electrical and/or mechanical interconnections between adjacent wafers within integrated circuit assemblies and structural integrity of those interconnections under temperature cycling conditions, is attained by utilizing laser assisted chemical vapor deposition to fabricate precisely configured metal posts which serve as such interconnections.